NDLI: Development of ultra thin plate-type heat pipe with less than 1 mm thickness

Content Provider	IEEE Xplore Digital Library
Author	Aoki, H. Shioya, N. Ikeda, M. Kimura, Y.
Copyright Year	2010
Description	Author affiliation: Furukawa Electr. Co., Ltd., Hiratsuka, Japan (Aoki, H.; Shioya, N.; Ikeda, M.; Kimura, Y.)
Abstract	Authors are reporting development of ultra thin heat pipe and its performance. The ultra thin heat pipe has thickness less than 1.0 mm and high capability of maximum heat transfer capacity, so that this heat pipe can be installed for narrow space, in which it have been difficult to apply the plate heat pipe so far, of the ultra compact information equipment such as Net Book PC. In this ultra thin heat pipe, the mesh wick which was conducted oxidation-reduction process in high temperature was used in order to obtain sufficient capillary pressure for circulation of the working fluid. The ultra thin heat pipe consists of this mesh wick and the copper container which has thin wall. This structure ensures both sufficient capillary pressure and space of vapor flow. Two kinds of the ultra thin heat pipe were made; one was 1.0 mm thickness and the other was 0.7 mm thickness. These heat pipes had high maximum heat transfer capacity comparing with conventional groove heat pipe. In this paper, we proposed the ultra thin heat pipe which consists of high capillary pressure wick, and experimental investigation is discussed.
Starting Page	217
Ending Page	222
File Size	421965
Page Count	6
File Format	PDF
ISBN	9781424494583
ISSN	10652221
e-ISBN	9781424494606
e-ISBN	9781424494613
DOI	10.1109/STHERM.2010.5444289
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2010-02-21
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Heat transfer Space heating Water heating Thermal resistance Resistance heating Thermal force Temperature Thermal loading Copper Containers Thermal Resistance Thin Heat Pipe Mesh Wick Structure Capillary Pressure Pressure Drop Capillary Force Limit Maximum Heat Transfer Capacity
Content Type	Text
Resource Type	Article

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in

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