NDLI: Process and chamber health monitoring of plasma enhanced ti deposition process through high performance VI-probe

Content Provider	IEEE Xplore Digital Library
Author	Kye Hyun Baek Coonan, B. Carbery, M. Jinkyung Joo Hyunsoo Woo Tae Soon Lee Hyeon Soo An Yoonbon Koo Cheonsu Han Sungho Han Yongjin Kim Seong Woon Choi Woosung Han
Copyright Year	2007
Description	Author affiliation: Samsung Electron. Co. Ltd., Hwasung (Kye Hyun Baek)
Abstract	As an alternative to plasma sensors, high performance VI probe was evaluated in a plasma enhanced Ti deposition process. Its utilization was focused on finding any reasonable differences between good and bad chambers classified in terms of end of line yield data. Some differences of delivered power and time trace current signal between chambers were found, which well matches the good and bad chamber classification. Also, a fault detection and classification algorithm to handle huge amount of raw VI-probe data was evaluated. The algorithm estimates deviation of $TiCl_{4}$ content in plasma occurs right after preventive maintenance, which might be considered as a chamber conditioning procedure. Despite requiring additional evaluations, the combination of VI-probe and well-developed algorithm might be a feasible solution where conventional plasma sensors can not be applied.
Starting Page	1
Ending Page	4
File Size	1150094
Page Count	4
File Format	PDF
ISBN	9781424411412
ISSN	1523553X
DOI	10.1109/ISSM.2007.4446841
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2007-10-15
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Monitoring Plasma applications Plasma measurements Plasma materials processing Sensor phenomena and characterization Plasma properties Inductors Plasma devices Signal processing Probes
Content Type	Text
Resource Type	Article
Subject	Industrial and Manufacturing Engineering Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in

Characterization of ultra-short pulsed discharge plasma for CVD processing

Plasma desorption and decomposition

Monitoring plasma-process induced damage in thin oxide

A rotating arc plasma reactor for industrial applications

A fast plasma induced damage monitoring method

Charging damage from plasma enhanced TEOS deposition

Growth and properties of nanocrystalline germanium and germanium-carbide films and devices

A novel approach to monitoring of plasma processing equipment and plasma damage without test structures

Damascene Cu : Dielectric nitride capping surface plasma treatment optimization for flash memory devices

Process and chamber health monitoring of plasma enhanced ti deposition process through high performance VI-probe

Similar Documents

Characterization of ultra-short pulsed discharge plasma for CVD processing

Plasma desorption and decomposition

Monitoring plasma-process induced damage in thin oxide

A rotating arc plasma reactor for industrial applications

A fast plasma induced damage monitoring method

Charging damage from plasma enhanced TEOS deposition

Growth and properties of nanocrystalline germanium and germanium-carbide films and devices

A novel approach to monitoring of plasma processing equipment and plasma damage without test structures

Damascene Cu : Dielectric nitride capping surface plasma treatment optimization for flash memory devices

Process and chamber health monitoring of plasma enhanced ti deposition process through high performance VI-probe