NDLI: High temperature, high power density packaging for automotive applications

Content Provider	IEEE Xplore Digital Library
Author	Gerber, M. Ferreira, J.A. Hofsajer, I.W. Seliger, N.
Copyright Year	2003
Description	Author affiliation: Power Electron. & Electr. Machines, Delft Univ. of Technol., Netherlands (Gerber, M.; Ferreira, J.A.)
Abstract	The automotive industry is pushing power electronic packaging to higher operating and heatsink temperatures while still requiring very high power densities due to limited space. Currently, the power electronics that is implemented within the engine compartment of the vehicle must operate with heatsink temperatures of approximately 85/spl deg/C and this temperature can be expected to increase to 125/spl deg/C in the near future. The high temperature operation of the power electronic structure is fundamentally limited by the employed materials maximum temperatures. A packaging concept is introduced that describes a structure realisation that enables the materials to operate at high ambient temperatures without exceeding their individual maximum temperatures. This in turn allows the complete power electronic structure to operate at a higher system temperature. In this paper, the packaging concept that can be used to meet these difficult requirements of high temperature and high power-density is introduced, discussed and implemented. Two case studies are considered and implemented to illustrate the packaging concept.
Starting Page	425
Ending Page	430
File Size	589474
Page Count	6
File Format	PDF
ISBN	0780377540
ISSN	02759306
DOI	10.1109/PESC.2003.1218329
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2003-06-15
Publisher Place	Mexico
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Temperature Automotive applications Electronics packaging Power electronics Space heating Automotive engineering Aerospace industry Electronics industry Engines Vehicles
Content Type	Text
Resource Type	Article

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in

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