NDLI: High temperature electronics: R&D challenges and trends in materials, packaging and interconnection technology

Content Provider	IEEE Xplore Digital Library
Author	Amalu, E.H. Ekere, N.N. Bhatti, R.S.
Copyright Year	2009
Description	Author affiliation: Electronics Manufacturing Engineering Research Group, School of Engineering at Medway, University of Greenwich, Chatham Maritime, Kent, ME4 4TB, UK (Amalu, E.H.; Ekere, N.N.; Bhatti, R.S.)
Abstract	The development of new high temperature electronics (HTE)/systems is the key to achieving high reliability safety critical operations in aerospace, automotive and well-logging applications. Reliability issues associated with the operation of HTE devices have been shown to account for some of the recent aircraft crashes as well as failures of the electronic control Unit in modern vehicles. The reliability of electronic systems is partly dependent on its operating ambient conditions; and reliability generally decreases in harsh operating conditions. The life expectancy of components and systems is known to reduce exponentially as the operating temperature increases; adversely impacting long-term system reliability. As under-bonnet, aerospace and well-logging applications require the direct exposure of sensors to very harsh conditions - these applications demand new HTE systems which can operate reliably in harsh conditions whilst preserving their properties/functions over long operating periods. The packaging and interconnection of the new HTE systems requires better understanding of the complex interactions between HTE system parameters and specific environmental conditions. The paper presents an overview of HTE research, reviews the trends in materials, component packaging and interconnect technology. The paper also outlines the key challenges in HTE research and the outstanding R&D issues.
Starting Page	146
Ending Page	153
File Size	134374
Page Count	8
File Format	PDF
ISBN	9781424435227
ISSN	08558906
DOI	10.1109/ICASTECH.2009.5409731
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2009-01-14
Publisher Place	Ghana
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Temperature Vehicle crash testing Materials Aerospace electronics Automotive engineering Aerospace control Vehicles Packaging HTE Aerospace materials Aerospace safety Miniaturization Aircraft Electronics packaging
Content Type	Text
Resource Type	Article

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