NDLI: Electromagnetic simulation of the EMI shield package with aperture

Content Provider	IEEE Xplore Digital Library
Author	Su-Hwang Kim Seung-Han Kim Dong-Ju Kim Jeong-Hoon Cho Hyuk Lim Jae-Hyung Jang
Copyright Year	2008
Description	Author affiliation: Dept. of Inf. & Commun., Gwangju Inst. of Sci. & Technol. (GIST), Buk-gu (Su-Hwang Kim; Seung-Han Kim; Dong-Ju Kim; Hyuk Lim; Jae-Hyung Jang) \|\| LG Components R&D Center, Ansan (Jeong-Hoon Cho)
Abstract	By employing bond-wires connecting the top cover and the PCB ground plane, the shielding effectiveness could be dramatically improved. The packages with a thicker and larger number of bond-wires exhibit better performance. At least 4 bond-wires should be inserted to prevent resonance within the third harmonic frequency for the present structure. For the same number of bond-wires, the equally spaced bond-wires exhibit the best shielding effectiveness and the highest resonance frequency. Thus, careful selection of the location, spacing and number of bond-wires can significantly improve the EMI shielding effectiveness of the RF SiP module.
Starting Page	1
Ending Page	4
File Size	417551
Page Count	4
File Format	PDF
ISBN	9781424426416
DOI	10.1109/APMC.2008.4958653
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2008-12-16
Publisher Place	China
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Electromagnetic shielding Electromagnetic interference Packaging Apertures Bonding Radio frequency Electromagnetic radiation Resonance Resonant frequency Gold
Content Type	Text
Resource Type	Article

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