NDLI: Temporal instability of suppressor ensembles under reactive conditions

Content Provider	IEEE Xplore Digital Library
Author	Fluegel, A. Arnold, M. Wagner, A. Mayer, D. Hai, M.N.T. Trung, H.T.M. Odermatt, J. Broekmann, P.
Copyright Year	2011
Description	Author affiliation: Department of Chemistry and Biochemistry, University of Bern, 3012, Switzerland (Hai, M.N.T.; Trung, H.T.M.; Odermatt, J.) \|\| BASF SE, Electronic Materials, 67056 Ludwigshafen, Germany (Fluegel, A.; Arnold, M.; Wagner, A.; Mayer, D.; Broekmann, P.)
Abstract	The temporal instability of different types of suppressor additives relevant for Damascene and 3D-TSV copper electroplating is studied by means of potential transient experiments in combination with structure sensitive methods such as in-situ scanning tunneling microscopy and in-situ synchrotron x-ray diffraction. The molecular interplay of various types of suppressor additives with their specific antagonists at the copper/electrolyte interface is discussed in the light of the successful fill of sub-50nm Damascene features and μm-sized 3D-TSVs.
Starting Page	1
Ending Page	3
File Size	603224
Page Count	3
File Format	PDF
ISBN	9781457705038
e-ISBN	9781457705021
DOI	10.1109/IITC.2011.5940319
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2011-05-08
Publisher Place	Germany
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Copper Surface treatment Additives Electric potential Chemistry Electrodes Acceleration
Content Type	Text
Resource Type	Article

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