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2015 IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM)

IEEE International Interconnect Technology Conference

2013 IEEE International Interconnect Technology Conference - IITC

2012 IEEE International Interconnect Technology Conference

2011 IEEE International Interconnect Technology Conference

2011 IITC Organizing committee

Past general co-chairs

2011 IITC program committee

Table of contents

Atomic layer deposition for nanoscale contact applications

Direct seed electroplating of copper on ruthenium liners

Investigations on Ru-Mn films as plateable Cu diffusion barriers

Enabling Cu-Cu connection in (dual) damascene interconnects by selective deposition of two different SAM molecules

Interconnect technologies for SmartPower integrated circuits in the area of automotive power applications

Process transfers provide opportunities for more reliable products

Qualification of extrinsics in BEOL - the new challenge

Interconnect performance and energy-per-bit for post-CMOS logic circuits: Modeling, analysis, and comparison with CMOS logic

Mechanism of resistivity decrease in networked-nanographite wires for multi-layer graphene interconnects

Integration of dense CNTs in vias on 200mm diameter wafers: Study of post CNT growth processes

Carbon nanotube interconnects: Electrical characterization of 150 nm CNT contacts with Cu damascene top contact

Evaluation of aluminum film properties and microstructure for replacement metal gate application at 28nm technology node

Post Porosity Plasma Protection a new approach to integrate k ≤ 2.2 porous ULK materials

64 nm pitch Cu dual-damascene interconnects using pitch split double exposure patterning scheme

Improvement of RC performance for advanced ULK/Cu interconnects with CVD hybrid dielectric/metal liner

Thermal and spatial dependence of TSV-induced stress in Si

Orthotropic stress field induced by TSV and its impact on device performance

ZrBO dielectrics for TSV production process

Strain measurement for the semiconductor industry with nm-scale resolution by dark field electron holography and nanobeam electron diffraction

Stress-induced voids in Ni-Pt silicide: Disconnection of narrow (Ni-Pt)Si between gate canyons on wide active area

Millisecond annealing for salicide formation: Challenges of NiSi agglomeration free process

CVD-cobalt for low resistance word line electrode of 3D NAND flash memory

NiSi nano-contacts to strained and unstrained silicon nanowires

Aspects of chip/package interaction and 3-D integration assessed by the investigation of crack and damage phenomena in low-k BEoL stacks

Shear microprobing of chip-package interaction in advanced interconnect structures

Silicon photonics integration with electronic circuit

Benchmarking on-chip optical against electrical interconnect for high-performance applications

Future of PECVD and spin-on ultra low-k materials

Highly reliable Enhanced Nitride Interface (ENI) process of barrier Low-k using absorption-free Ultra-Thin SiN (UT-SiN)

CVD Co capping layers for Cu/low-k interconnects: Cu EM enhancement vs. Co thickness

Nanoindentation for quality control of ULK films

Direct measurement of grain boundary resistance in copper nanowires

Comprehensive lifetime prediction for intrinsic and extrinsic TDDB failures in Cu/Low-k interconnects

Impact of low-k moisture absorption during queue-time on Cu-alloy/low-k reliability and its suppression

Effects of metal-cap coverage on electro-migration (EM) tolerance for scaled-down Cu interconnects

Backend-of-line reliability improvement options for 28nm node technologies and beyond

Line Edge Roughness (LER) correlation and dielectric reliability with Spacer-Defined Double Patterning (SDDP) at 20nm half pitch

Scaling effect of device area and film thickness on electrical and reliability characteristics of RRAM

Demonstration of Phase Change Memories devices using Ge2Sb2Te5 films deposited by Atomic Layer Deposition

Fully CMOS BEOL compatible HfO2 RRAM cell, with low (μA) program current, strong retention and high scalability, using an optimized plasma enhanced atomic layer deposition (PEALD) process for TiN electrode

3D technology roadmap and status

Process and RF modelling of TSV last approach for 3D RF interposer

Study of the evolution of Cu-Cu bonding interface imperfection under direct current stressing for three dimensional integrated circuits

Yield improvement and ramp-up to production of advanced CMOS technologies interconnects

Optimization of porous ultra low-κ dielectrics (κ ≤ 2.55) for 28nm generation

Robust self-aligned via process for 64nm pitch Dual-Damascene interconnects using pitch split double exposure patterning scheme

Cu electromigration improvement by adhesion promotion treatment (APT)

Fundamental study of atomic layer deposition in and on porous low-k films

CPI assessment using a novel characterization technique based on bump-assisted scratch-indentation testing

In-situ study and modeling of the decreasing reaction rate at the end of CoSi2 formation

Characterization of thermal stability of Ni(SiGe)/n-SiGe contact formed by isothermal annealing

Photo-imageable spin-on dielectrics for TSV 3D packaging applications

Investigation of electrical programmable metal fuse in 28nm and beyond CMOS technology

Low damage etch approach for next generation Cu interconnect

Multilevel interconnect networks for the end of the roadmap: Conventional Cu/low-k and emerging carbon based interconnects

Surface modification of porous low-k material by plasma treatment and its application on reducing the damage from sputtering and CMP process

Process integration of iALD TaN for advanced Cu interconnects

Robust porous SiOCH (k=2.5) for 28nm and beyond technology node

Comparison of electrical performances of metal-insulator-metal capacitors with sputtered HfO2 and BZT-HfO2 dielectrics

Temporal instability of suppressor ensembles under reactive conditions

Grain boundary as relevant microstructure feature for electromigration in advanced technology studied by Electron BackScattered Diffraction

Investigation of ultra-thin Al2O3 film as Cu diffusion barrier on low-k (k=2.5) dielectrics

Ultrathin TaN/Ta barrier modifications to fullfill next technology node requirements

Si ohmic contacts on N-type SiC

Impact of through-silicon-via scaling on the wirelength distribution of current and future 3D ICs

A study of TSV variation impact on power supply noise

Impact of TSV proximity on 45nm CMOS devices in wafer level

Wet process optimization to deposit conformal Cu diffusion barrier into TSV

Helium ion microscope characterization for Cu / low-k interconnects - SE imaging and focused helium ion beam luminescence detection -

Electrical property improvements of ultra low-k ILD using a silylation process feasible for process integration.

Reliability performance of advanced metallization options for 30nm ½ pitch in SiCOH low-k materials

Texture change of NiSi film with dopant implantation

Behavior of the alloying element in Cu interconnects

Control of plasma polymerization reaction for the $2^{nd}$ generation molecular_pore_stack (MPS) SiOCH film with high deposition rate

Relevance of electromigration wafer level test for advanced CMOS interconnects reliability control

Crack propagation and delamination analysis within the die by camera-assisted double cantilever beam technique

Copper electrochemical deposition in macroporous silicon arrays for through silicon via applications

Temporary passivation of Cu for low temperature (< 300°C) 3D wafer stacking

Cu dry-fill on CVD Ru liner for advanced gap-fill and lower resistance

Fundamental relationship between capacitance-time measurements and gravimetric measurements for water absorption in a low-k dielectric

Modeling and optimization for multi-layer graphene nanoribbon conductors

Highly reliable molecular-pore-stacking (MPS)/Cu interconnects using novel post-etching treatment (PET) for 28 nm-node and beyond

High-performance metal hard mask process using novel TiN film for 32-nm node Cu interconnect and beyond

CVD and ALD of Cobalt-tungsten alloy film as a novel Copper diffusion barrier

Thermal stability and interface improvement of thin NiSiGe by $C^{+}$ ion implantation

Cu damascene interconnects with an organic low-k fluorocarbon dielectric deposited by microwave excited plasma enhanced CVD

Influence of copper on the catalytic carbon nanotube growth process

Effect of oxygen diffusion into TiN on resistance switching characteristics of ZrO2 films with annealing temperatures

Impact of ambient atmosphere on plasma-damaged porous low-k characterization

Pad roughness effects on the planarization and material removal rate in CMP processes

Scatterometric Porosimetry for porous low-k patterns characterization

Investigation of local stress around TSVs by micro-Raman spectroscopy and finite element simulation

Thermal stability of copper Through-Silicon Via barriers during IC processing

Integrated NiSi defect reductions in 45nm node and beyond

Investigation on MOCVD CoSi2 process for reduction of contact resistance at metal-silicon interface

Robust low-voltage program-erasable capacitors of Pd-Al2O3-Si with high density Ru-based nanocrystals embedded

Nanowire filled polymer films for 3D system integration

The simplest modification of Cu diffusion barrier dielectrics to improve Cu/Low-k interconnects reliability

Electrical performances of low resistive W buried gate using B2H6-reduced W nucleation layer technology for 30nm-based DRAM devices

Lifetime of thermosonic copper ball bonds on aluminum metallization pads

Modulation of Schottky barrier height for NiSi/Si(110) diodes using an antimony interlayer

Grain structure effect on EM of Cu interconnects with CoWP capping - A statistical model

Reliability testing and Failure Analysis of 3D integrated systems

Quantum mechanical methods for the simulation of electronic transport through carbon nanotubes

2010 IEEE International Interconnect Technology Conference

2009 IEEE International Interconnect Technology Conference

2008 International Interconnect Technology Conference

2007 IEEE International Interconnect Technology Conferencee

2006 International Interconnect Technology Conference

Proceedings of the IEEE 2005 International Interconnect Technology Conference, 2005.

Proceedings of the IEEE 2004 International Interconnect Technology Conference (IEEE Cat. No.04TH8729)

Proceedings of the IEEE 2003 International Interconnect Technology Conference (Cat. No.03TH8695)

Proceedings of the IEEE 2002 International Interconnect Technology Conference (Cat. No.02EX519)

Proceedings of the IEEE 2001 International Interconnect Technology Conference (Cat. No.01EX461)

Proceedings of the IEEE 2000 International Interconnect Technology Conference (Cat. No.00EX407)

Proceedings of the IEEE 1999 International Interconnect Technology Conference (Cat. No.99EX247)

Proceedings of the IEEE 1998 International Interconnect Technology Conference (Cat. No.98EX102)

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