NDLI: Evaluation of various composition Cu-resin plates in sapphire DMP (Diamond Mechanical Polishing) process

Please wait, while we are loading the content...

2015 International Conference on Planarization/CMP Technology (ICPT)

The dynamics of the CMP discovery for device applications in IBM

Updates on Ge and SiGe CMP processes for integration as high mobility channel materials

Attributes of an advanced node cu-barrier slurry

Three dimensional pH - potential diagram of cobalt slurry with corrosion rate

CMP development of gallium nitride material

Effect of photocatalytic oxidation technology on GaN CMP

Proposal of cleanliness evaluation method of CMP pad, and investigation of cleaning effect by the high-pressure jet

Post cleaning and defect reduction for tungsten chemical mechanical planarization

FEOL CMP modeling: Progress and challenges

Reduced defectivity and cost of ownership copper CMP cleans using low pH, BTA free, noble-bond chemistry

A new contact model of pad surface asperities utilizing measured geometrical features

Reactive molecular dynamics simulation of Si chemical mechanical polishing process

Planarization with suspended polyurethane beads and a stiff counterface: Pad-in-a-bottle experiments and simulation

Single-molecule spectroscopic analysis of adsorption phenomena on colloidal silica abrasives used in chemical-mechanical planarization slurries

Efficient development of post-CMP cleans for ceria slurries

Effect of pad surface temperature and dry/ wet conditions on pad surface properties

Advanced Cu barrier CMP slurries: ACuPLANE™ 7000 platform

Mechanism of chemical mechanical polishing of Ti0.4Sb2Te3 film using KMnO4 as oxidizer in an acidic slurry

A novel platform for next generation pad conditioning

Brownian diffusion analysis for nano-abrasives in CMP slurry by using fluorescence polarization method

Non-uniformity and removal rate selectivity investigations in through silicon via front side CMP

Study on effect of back-surface treatment of silicon wafer in photo lithography process after CMP process

Planarization improvement using non-porous polishing pad in ILD CMP

The electrochemical behaviour during chemical mechanical polishing of Ti in peroxide based alkaline slurries

The elastic impact of polishing pad for sapphire polishing

Particle size distribution shift as a predictor of slurry stability

Application of a novel conditioning platform to a tungsten polishing process

Research on the manufacturing of high purity colloidal silica abrasive with controlled particle size

Optimization of CO2 bubbling (carbonation) for post CMP cleaning process

Evaluation of various composition Cu-resin plates in sapphire DMP (Diamond Mechanical Polishing) process

Next generation composite, rigid filter for Chemical Mechanical Planarization

The era of IoT advancing CMP consumables growth

Active dummy generation for homogeneity increase in a 130 nm SiGe-BiCMOS process

Optimized slurry compositions for the polishing of sapphire surfaces

Chemical mechanical planarization studies on gallium nitride for improved performance

Formation of dot patterns with particles using inkjet method to examine and inspect performance of CMP cleaning process

Challenges of TSV backside process integration

Simplification of Replacement Metal Gate CMP metrology for FinFET

Chemical mechanical polishing implementation on dental implants

Planarization limbo with silicon wafers

Qualification of a ceria slurry reclaim system for shallow trench isolation polish in high volume manufacturing

Study on evaluation method for surface topography of polishing pad based on optical Fourier transform

Ellipsometric measurement of particle-spiked wafer surfaces

In-line refractive index monitoring for CMP slurry fault detection

Investigation of CMP on GaN substrate for led manufacturing

A study of surface defects of GaN during CMP process

Light scattering analysis for undiluted slurry management

Normal force and behavior of containing water during the compression of PVA brush

Friction monitoring of conventional diamond conditioner and its application

Effects of silica abrasive size on sapphire CMP performances and their removal mechanisms

Investigation on cu height process control method in BEOL Cu CMP

Challenges in Post CMP in-situ cleaning for sub-14nm device yield enhancement

High-rate CMP process for large PCB by controlling platen coolant temperature

Study of inhibition mechanism of glycine on the electrochemical behavior of Mo in the alkaline slurry

Advanced CMP conditioning for front end applications

Accelerated corrosion and oxidation of tungsten plug during tungsten CMP

Yield improvement through improved uniformity via application of multi-zone polish head for STI-CMP

Repulsive effect between abrasives during CMP process

Influence into platen and polishing pad surface temperature on removal rate in sapphire-chemical mechanical polishing

CMP solutions for 3D-NAND staircase CMP

Effects of surface zeta potential on the filtration behavior of colloidal abrasives

Novel CMP slurry for polishing silicon containing materials

Conditioner characterization and implementation for impacts of diamonds on CMP pad texture and performance

Optimal shape of retainer ring considering edge exclusion and slurry film thickness

Removal mechanisms of glass and sapphire materials by slurry free lapping

Study on innovative plasma fusion CMP and its application to processing of diamond substrate

Optimization of machining conditions of basic-type CMP/P-CVM fusion processing using SiC substrate

Slurry free lapping of silicon wafer for the application of thinning of wafer backside during TSV and packaging

Proceedings of International Conference on Planarization/CMP Technology 2014

Evaluation of various composition Cu-resin plates in sapphire DMP (Diamond Mechanical Polishing) process

Content Provider	IEEE Xplore Digital Library
Author	Dong-Ha Kim Byoung-Jun Cho Jung-Hwan Lee Jin-Goo Park
Copyright Year	2015
Description	Author affiliation: Department of Bionanotechnology, Hanyang University, Ansan, 426-791, Korea (Dong-Ha Kim; Byoung-Jun Cho; Jung-Hwan Lee) \|\| Department of Materials Engineering, Hanyang University, Ansan, 426-791, Korea (Jin-Goo Park)
Abstract	In this study, the performance of sapphire lapping process using copper-resin plates in DMP (Diamond Mechanical Polishing) process was evaluated. Material removal rate (MRR) of sapphire increased linearly with the increase in rotation speed, pressure and lapping process time. MRR and roughness of sapphire wafers were correlated to the hardness of lapping plates with different Cu compositions. Cu-resin plates could achieve a good surface quality and proper removal rate of sapphire wafer as compared to metal plates. Also the sapphire removal mechanism was discussed based on the experimental results.
Starting Page	1
Ending Page	4
File Size	594602
Page Count	4
File Format	PDF
ISBN	9781619565104
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2015-09-30
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	American Vacuum Society
Subject Keyword	Powders Diamonds Propulsion Resins Substrates
Content Type	Text
Resource Type	Article

Central Library (ISO-9001:2015 Certified)
Indian Institute of Technology Kharagpur
Kharagpur, West Bengal, India | PIN - 721302

See location in the Map
03222 282435
Mail: support@ndl.gov.in

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in