NDLI: Reactive molecular dynamics simulation of Si chemical mechanical polishing process

Content Provider	IEEE Xplore Digital Library
Author	Jialin Wen Xinchun Lu
Copyright Year	2015
Description	Author affiliation: State Key Laboratory of Tribology, Tsinghua University, Beijing, China (Jialin Wen; Xinchun Lu)
Abstract	Reactive molecular dynamics simulations are used to simulate the chemical mechanical polishing process of silicon surface. The simulation process is carried out to investigate the interaction between SiO2 particle and Si surface in pure water. Both chemical and mechanical effects under different pressure between the silicon surface, water and a silica particle are clarified. This is the first application of reactive molecular dynamics simulation in the CMP area. According to the simulation results, H2O molecules are adsorbed on both the Si substrate and SiO2 particle surface, OH groups and H atoms are generated by the adsorption and dissociation of water. Interaction of these two surfaces leads to the formation of -Si-Si-O-Si- bond chain, and Si-Si bond of this bond chain is easier to be broken rather than the Si-O bond under the mechanical sliding effects, which leads to the removal of Si atoms. Besides, different kinds of pressure are applied to the SiO2 particle to investigate the role of mechanical pressure effects to the CMP process, and the results show that higher pressure leads to the removal of more Si atoms. This work sheds light on the atomic chemical and mechanical details of the Si CMP process and may provide efficient ways to design the slurry composites and optimize the pressure applied in the CMP process.
Starting Page	1
Ending Page	4
File Size	1108495
Page Count	4
File Format	PDF
ISBN	9781619565104
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2015-09-30
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	American Vacuum Society
Subject Keyword	Silicon Power capacitors Surface treatment
Content Type	Text
Resource Type	Article

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