NDLI: Novel CMP slurry for polishing silicon containing materials

Content Provider	IEEE Xplore Digital Library
Author	Chun-Chieh Lee Yun-Lung Ho Song-Yuan Chang Ming-Hui Lu Ming-Che Ho
Copyright Year	2015
Description	Author affiliation: 10 Nanyuan Rd., Zhongli Dist., Taoyuan City 320, Taiwan (R.O.C.), UWiZ Technology Co., Ltd. (Chun-Chieh Lee; Yun-Lung Ho; Song-Yuan Chang; Ming-Hui Lu; Ming-Che Ho)
Abstract	In this paper we will report a novel CMP slurry chemistry which can provide tunable removal selectivity between various silicon-containing materials, such as SiGe, bare silicon, poly silicon or amorphous silicon against SiO2 and/or SiN. The slurry chemistry is a non-hydrogen peroxide based system containing a novel catalyst. By adjusting the amount of the catalyst, we can fine tune desirable removal selectivity. Moreover, the novel catalyst can act either as a removal rate inhibitor or an enhancer for silicon removal rate depending on the alkalinity of slurry. At lower pH, it inhibits silicon RR as its dosage is increased; at higher pH, it flips, becoming an enhancer for silicon removal. Same tendency is revealed for poly-silicon and amorphous silicon, too. The novel catalyst does not impact on removal rate of TEOS or SiN, but on SiGe. The higher dosage of the novel catalyst the higher removal rate of SiGe becomes. Furthermore, the slurry has zero corrosion/etching rate on silicon containing materials.
Starting Page	1
Ending Page	4
File Size	591813
Page Count	4
File Format	PDF
ISBN	9781619565104
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2015-09-30
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	American Vacuum Society
Subject Keyword	Silicon compounds Silicon Substrates Chemicals
Content Type	Text
Resource Type	Article

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in

Preparation and application of benzoguanamine formaldehyde/silica composite abrasives slurry

Development of copper CMP slurry

Effects of colloidal silica on the CMP of Molybdenum in the alkaline slurry

n A Fine Atomization CMP Slurry for Copper

Effects of Slurry in Cu Chemical Mechanical Polishing (CMP) of TSVs for 3-D IC Integration

Study on controlling mechanism of step-terrace structure in CeO2 slurry polishing of 4H-SiC

The effects of fluids on the deformation and ductile-to-brittle transition of silicon.

Novel approach to CMP slurry filtration through new generation nano-fiber technology

Cmp Polishing Slurry and Method of Polishing Substrate Technical Field

Novel CMP slurry for polishing silicon containing materials

Similar Documents

Preparation and application of benzoguanamine formaldehyde/silica composite abrasives slurry

Development of copper CMP slurry

Effects of colloidal silica on the CMP of Molybdenum in the alkaline slurry

n A Fine Atomization CMP Slurry for Copper

Effects of Slurry in Cu Chemical Mechanical Polishing (CMP) of TSVs for 3-D IC Integration

Study on controlling mechanism of step-terrace structure in CeO2 slurry polishing of 4H-SiC

The effects of fluids on the deformation and ductile-to-brittle transition of silicon.

Novel approach to CMP slurry filtration through new generation nano-fiber technology

Cmp Polishing Slurry and Method of Polishing Substrate Technical Field

Novel CMP slurry for polishing silicon containing materials