NDLI: Sensitivity effect of elastic modulus on combined stress of hot forging die

Content Provider	IEEE Xplore Digital Library
Author	Chenggang Pan Huachang Wang Jialin Zhou
Copyright Year	2010
Description	Author affiliation: Key Laboratory for Ferrous Metallurgy and Resources Utilization of Ministry of Education, Wuhan University of Science and Technology, China (Jialin Zhou) \|\| School of Materials Science and Engineering, Wuhan University of Technology, China (Chenggang Pan; Huachang Wang)
Abstract	Stresses, including thermal, mechanical and combined stress, are the root causes leading to hot forging die failure. Stress amplitude is affected by the material properties, such as elastic modulus. In order to select die material for improving die service life, a 2D FE model of cake shaped workpiece is developed to analyze thermal, mechanical and combined stress of hot forging die with different level elastic modulus. Three kinds of stress distribution are explored. The results show that thermal stress is about 10 times than mechanical stress at the die cavity surface which is the easiest failure location, and approximate linear relationship exists between stress, including thermal and combined stress, and elastic modulus. Die material with large room temperature and temperature-sensitive elastic modulus should be selected.
Starting Page	216
Ending Page	219
File Size	271195
Page Count	4
File Format	PDF
ISBN	9781424477371
e-ISBN	9781424477395
DOI	10.1109/MACE.2010.5535622
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2010-06-26
Publisher Place	China
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Elastic modulus Temperature Educational technology Iron Capacitive sensors Sensivity analysis Hot forging die Forging Materials science and technology Compressive stress Thermal loading Thermal stresses Material properties Combined stress
Content Type	Text
Resource Type	Article

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