NDLI: Recent progress in popcorn performance and cost reduction of QFP160 using Ni-Pd plated dambar less lead frames

Content Provider	IEEE Xplore Digital Library
Author	Kuehnlein, G.
Copyright Year	1998
Description	Author affiliation: ESEC-BDM, Netherlands (Kuehnlein, G.)
Abstract	Reliability performance and cost reduction are the two main issues at present in the semiconductor back end assembly industry. A major step in cost reduction could be the dambar-less molding process, which reduces the trimming and forming costs. Together with Ni-Pd plated lead frames, which eliminates the pretinning process, significant cost reduction could be achieved, but current molding technology does not allow flash and bleed-free dambar-less molding. In addition, the existing molding compounds suffer from a fatal drawback: limited reliability performance due to poor popcorn resistance, mostly induced by insufficient adhesion of the encapsulant to the Ni-Pd plated lead frame. Indeed, no high pin count devices using the Ni-Pd plating technology are available on the market. The use of Pre-Packed Processing (3P/sup R/) technology and processes together with a recently developed high performance compound without mold-release agents but using special adhesion promoters has virtually eliminated these problems and successfully achieved dambar-less molded devices with JEDEC-level 1 popcorn resistance on Ni-Pd plated lead frames. These results are presented and discussed with emphasis on 3P/sup R/ technology and the newly developed molding compound.
Starting Page	325
Ending Page	330
File Size	835027
Page Count	6
File Format	PDF
ISBN	078035141X
DOI	10.1109/EPTC.1998.756024
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	1998-12-10
Publisher Place	Singapore
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Costs Adhesives Viscosity Wire Lead Semiconductor device reliability Assembly Information analysis Shape Cleaning
Content Type	Text
Resource Type	Article

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