NDLI: Novel rework techniques for electronic assemblies

Content Provider	IEEE Xplore Digital Library
Author	Stennett, A.D. Whalley, D.C.
Copyright Year	1998
Description	Author affiliation: Dept. of Manuf. Eng., Loughborough Univ., UK (Stennett, A.D.)
Abstract	Soft soldering is the primary joining technology used in electronics assembly and is expected to remain so for the foreseeable future. Component removal for rework and repair is traditionally achieved by remelting of the solder, but the exposure of the assembly or its component parts to repeated soldering/desoldering cycles may cause both immediate damage and create a significant long term reliability hazard. Rework is also currently labour intensive and requires skilled operators. Area array components, such as ball grid arrays (BGAs), further increase rework process complexity due to the number and inaccessibility of the solder joints and, for some devices, the necessity to remove and replace the solder balls before component replacement. There is also a growing requirement to recycle/reclaim electronic waste, creating the need for an effective process for dismantling of printed circuit board assemblies (PCBAs). This paper presents a brief review of alternative nonthermal techniques for rework or dismantling of conventional soldered assemblies, including both chemical etchants and mechanical techniques. Results are then presented on trials of chemical etchants, where solder removal rates consistent with realistic times for component removal have been readily achieved using commercially available tin-lead strippers. Electrochemical techniques are also shown to be usable in specific applications, i.e. where electrical contact can be readily made to the solder joints to be removed and have the advantage of reclaiming the removed solder directly from the electrolyte.
Starting Page	196
Ending Page	201
File Size	1025920
Page Count	6
File Format	PDF
ISBN	078035141X
DOI	10.1109/EPTC.1998.756001
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	1998-12-10
Publisher Place	Singapore
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Assembly Soldering Chemicals Etching Hazards Electronics packaging Recycling Electronic waste Printed circuits Contacts
Content Type	Text
Resource Type	Article

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in

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