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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Hamidnia, M. Liangliang Zou Yi Luo Xiaodong Wang |
| Copyright Year | 2015 |
| Description | Author affiliation: Key Lab. for Micro/Nano Technol. & Syst. of Liaoning Province, Dalian Univ. of Technol., Dalian, China (Hamidnia, M.; Liangliang Zou; Yi Luo; Xiaodong Wang) |
| Abstract | The thermal management of light-emitting diode (LED) packaging modules has become more important in the electronic industrials. High temperatures during lighting resulting in luminance decay, color temperature drift, life time decline and generally efficiency decrease. Low thermal resistance, low cost and high potential for mass production of Si, lead to improve its usage in LED packaging. For this issue, this paper proposes a silicon-based LED packaging module with thin gold sputtered layer on the top surface of silicon substrate and a bulk micro machined cavity on the other side. In two different configuration, LED die directly is mounted on flat surface and cup cavity of silicon with various area of Au layer and volume of cavity. Afterwards, by in-situ measuring the temperature of substrate and finite element simulation, the temperature distribution of silicon submount is evaluated. The results of experiment and simulation were very similar and confirm that heat conductivity of package which LED directly is mounted on flat surface is higher than one which LED mounted in cup cavity. |
| Starting Page | 530 |
| Ending Page | 533 |
| File Size | 478265 |
| Page Count | 4 |
| File Format | |
| e-ISBN | 9781467379991 |
| DOI | 10.1109/ICEPT.2015.7236642 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2015-08-11 |
| Publisher Place | China |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Heating Cavity resonators Semiconductor device measurement Silicon Light emitting diodes Thermal management Silicon-based LED package MEMS fabrication |
| Content Type | Text |
| Resource Type | Article |
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