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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Wang Yuming Zhang Shengyu Ding Yingjie Shi Haijian |
| Copyright Year | 2015 |
| Description | Author affiliation: Tsinghua-Flextronics SMT Lab., Tsinghua Univ., Beijing, China (Wang Yuming; Zhang Shengyu) || Electron. Assembly Workshop, Shanghai Xinyue Instrum. Factory, Shanghai, China (Ding Yingjie; Shi Haijian) |
| Abstract | For electronic products operating under the vibration environment, generally solder joints fail due to break of the solder joints on the board at the high-stress position. How can we know the high-stress area on the printed-circuit board? Why a high stress is generated in these areas? How can solder joint break and failure be solved? Now the above issues actually exist in the industry. This paper conducts finite element analysis on the circuit board components by using the finite element mathematical computing method in order to analyze the dynamic characteristicss and random vibration features and establish the simulation model. With these experiments, this paper conducts the modal analysis, response analysis and stress distribution analysis of this board. To compare these analysis with the established model and correct and fit the model, this model becomes the relatively accurate simulation model of the printed-circuit board and is applied into the actual electronic products, so it can improve product reliability, accelerate R&D progress and save the cost. |
| Starting Page | 856 |
| Ending Page | 859 |
| File Size | 703662 |
| Page Count | 4 |
| File Format | |
| e-ISBN | 9781467379991 |
| DOI | 10.1109/ICEPT.2015.7236715 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2015-08-11 |
| Publisher Place | China |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Computational modeling Analytical models Acceleration Stress Reliability Life estimation Admittance reliability Finite element modeling simulation optimization |
| Content Type | Text |
| Resource Type | Article |
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