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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Wei Jiang Lifeng Wang |
| Copyright Year | 2015 |
| Description | Author affiliation: Harbin Univ. of Sci. & Technol., Harbin, China (Wei Jiang; Lifeng Wang) |
| Abstract | In this paper, the thermal cyclic loading was adopted to analyze TSV copper cylinders stress distribution by using simulation software ANSYS, a cycle is 29min, the temperature range from-55 to 125°C. In order to study the stress of copper cylinders in TSV, at the first a set of suitable parameters were used to simulate the stress, then the structure parameters were optimized in this paper, and take copper cylinders maximum von-mises stress as response, by using MINITAB software and Taguchi orthogonal test method to analyse the influence of the copper cylinders diameter, copper cylinders height, copper cylinders pitch on the stress of copper cylinders in TSV. The simulation based on a set of suitable parameters, the results shown that the maximum von-mises stress was located at the outer corner of the copper cylinders in contact with the bottom position. Orthogonal test method was used, which found that the copper cylinders diameter had a big influence on maximum von-mises stress of copper cylinders, copper cylinders height followed, copper cylinders pitch minimal impact. By average of main effects plot found that within the parameters selected range, maximum von-mises follows a non-monotonic trend for TSV diameter and TSV height and also found that with the increase of the TSV pitch the stress between the outer corner and the bottom of the copper cylinders decrease gradually. |
| Starting Page | 226 |
| Ending Page | 230 |
| File Size | 861130 |
| Page Count | 5 |
| File Format | |
| e-ISBN | 9781467379991 |
| DOI | 10.1109/ICEPT.2015.7236581 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2015-08-11 |
| Publisher Place | China |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Finite element analysis Substrates Packaging Taguchi orthogonal test simulation thermal cyclic loading copper cylinders parameters |
| Content Type | Text |
| Resource Type | Article |
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