NDLI: Development and deployment of a multi-component Advanced Process Control system for an epitaxy tool

Content Provider	IEEE Xplore Digital Library
Author	Moyne, J. Solakhian, V. Yershov, A. Anderson, M. Mockler-Hebert, D.
Copyright Year	2002
Description	Author affiliation: Brooks Autom. Inc., Chelmsford, MA, USA (Moyne, J.; Solakhian, V.; Yershov, A.)
Abstract	A multi-component Advanced Process Control (APC) system has been developed and deployed for an Applied Materials vapor phase epitaxy tool at Fairchild Semiconductor. The system, which is fully automated, operates on a SEMI APC framework compliant platform, supports the plug-and-play of multiple APC applications ("plug-ins"), and has configurable control rules that allow the user to specify not only how each APC application will be utilized, but also how the APC applications will interact in a complementary fashion. The current system contains real-time data visualization, run-to-run control (R2R), and fault detection and classification (FDC) plug-ins. The data visualization component is currently being utilized for real-time visual monitoring of aspects of equipment health. The R2R component includes a multivariate algorithm and is being used to provide multi-zone control of deposition thickness and resistivity. The FDC component will gather the in-process data from the tool to automatically determine equipment health and classify faults in order to reduce mean time to repair. In this paper, the methodology used to deploy and configure this APC system is described. Data is provided illustrating the use of each of these APC capabilities individually and in complementary fashion. Data analysis is included that focuses on the benefits of utilizing these capabilities, benefits such as improved equipment reliability, improved overall equipment effectiveness and yield. The paper also includes a discussion of the benefits and issues associated with the complementary utilization of multiple APC components in an open architecture framework.
Sponsorship	IEEE Electron Devices Soc. Components, Packagin & Manuf. Technol. Soc. MICRO
Starting Page	125
Ending Page	130
File Size	839521
Page Count	6
File Format	PDF
ISBN	0780371585
DOI	10.1109/ASMC.2002.1001587
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2002-04-30
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Process control Epitaxial growth Automatic control Control systems Data visualization Semiconductor materials Real time systems Fault detection Monitoring Thickness control
Content Type	Text
Resource Type	Article

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
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9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in

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