NDLI: A high sensitivity force sensor for microassembly: design and experiments

Content Provider	IEEE Xplore Digital Library
Author	Yantao Shen Ning Xi Wen Jung Li Jindong Tan
Copyright Year	2003
Description	Author affiliation: Dept. of Electr. & Comput. Eng., Michigan State Univ., East Lansing, MI, USA (Yantao Shen; Ning Xi)
Abstract	This paper aims at advancing micromanipulation technology with in-situ PVDF piezoelectric force sensing during microassembly and packaging process. To allow close monitoring of magnitude and direction of forces (adhesion, surface tension, friction, and assembly force) acting on micro devices during manipulation, the polyvinylidene fluoride (PVDF) is used to fabricate highly sensitive 1-D and 2-D sensors for assembly of micro devices. By using an electronic circuit designed with the effective data processing techniques, the contact/impact force signal can be obtained desirably and then is fed back for improving the reliability of assembly. The calibration of the sensor has been conducted on a high precision optical microscope system with the optimal image processing methods. Preliminary calibration results verify the effectiveness of the sensor model with high sensitivity as well as a resolution in the range of sub-/spl mu/N. Furthermore, experiments demonstrate the performance of the force sensing system. Ultimately the technology will provide a critical and major step towards the development of automated manufacturing processes for batch assembly of micro devices.
Sponsorship	IEEE Ind. Electron. Soc.(IES) IEEE Robotics & Autom. Soc. (RAS) ASME Dynamic Syst. & Control Div. (DSC)
Starting Page	703
Ending Page	708
File Size	569181
Page Count	6
File Format	PDF
ISBN	0780377591
DOI	10.1109/AIM.2003.1225429
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2003-07-20
Publisher Place	Japan
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Force sensors Microassembly Assembly Calibration Optical sensors Optical microscopy Electronics packaging Monitoring Adhesives Surface tension
Content Type	Text
Resource Type	Article

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