NDLI: Process control for the low temperature deposition of niobium-nitride thin films

Content Provider	IEEE Xplore Digital Library
Author	Anderson, A.C. Lichtenwalner, D.J. Brogan, W.T.
Copyright Year	1965
Abstract	The authors investigated the process of DC and RF magnetron reactive sputtering of NbN with the purpose of clarifying the issues which are important for process control. Based on a simple physical model of the deposition process, parameters (plasma impedance and plasma concentration of reactive species) have been selected for study and their effects on the properties of the films (transition temperature, room temperature resistance, and RF surface impedance) have been evaluated experimentally. Based on these experiments, a simple feedback scheme using the plasma impedance as a control parameter was implemented, allowing for the consistent deposition of high-quality films. The same scheme can be used for the control of the stoichiometry of any reactive sputtering process, including the deposition of the high-transition-temperature oxide films.<>
Sponsorship	IEEE Magnetics Society
Starting Page	2084
Ending Page	2088
Page Count	5
File Size	428491
File Format	PDF
ISSN	00189464
Volume Number	25
Issue Number	2
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	1989-03-01
Publisher Place	U.S.A.
Access Restriction	One Nation One Subscription (ONOS)
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Process control Sputtering Plasma temperature Superconductivity Niobium Superconducting thin films Superconducting films Plasma properties Superconducting magnets Surface impedance
Content Type	Text
Resource Type	Article
Subject	Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering

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