NDLI: Processing of thick-film dielectrics compatible with thin-film superconductors for analog signal processing devices

Content Provider	IEEE Xplore Digital Library
Author	Wong, S.C. Anderson, A.C. Rudman, D.A.
Copyright Year	1965
Abstract	The authors demonstrate the feasibility of integrating thick-film dielectrics with thin-film superconductors in the fabrication of signal processing devices. Thin films of Nb and NbN are deposited by RF sputtering and patterned photolithographically. Thick film dielectrics can be spun on to a controlled thickness of 10 to 25 mu m, which is an optimum range for high-density, low-loss microwave delay lines. After an organic-binder burnout step at 450 degrees C in air, the ceramic dielectrics are sintered onto the NbN thin films at 850 degrees C in vacuum. The transition temperature of the NbN changes from 15 K as sputtered to 9 K after sintering, but superconductivity is preserved by the presence of thin-film MgO and SiO/sub 2/ barrier layers. Lumped-element resonators, in which the inductor and the capacitor electrodes are made of NbN and the dielectric of thick-film ceramic, have been successfully fabricated for measuring the dielectric properties of the ceramics at 4.2 K and 10 MHz. Preliminary results indicate a dielectric constant of 6-8 and tan delta of 10/sup -2/.<>
Sponsorship	IEEE Magnetics Society
Starting Page	1255
Ending Page	1257
Page Count	3
File Size	307939
File Format	PDF
ISSN	00189464
Volume Number	25
Issue Number	2
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	1989-03-01
Publisher Place	U.S.A.
Access Restriction	One Nation One Subscription (ONOS)
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Dielectric thin films Sputtering Superconducting thin films Ceramics Dielectric devices Thin film devices Superconducting devices Fabrication Signal processing Niobium
Content Type	Text
Resource Type	Article
Subject	Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering

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