NDLI: Advanced Surface Laminar Circuits Using Newly Developed Resins

Content Provider	IEEE Xplore Digital Library
Author	Hayashi, K. Yamanaka, K. Kobayashi, K. Hosoi, Y. Fukui, M.
Copyright Year	2011
Abstract	This paper introduces a newly developed advanced surface laminar circuit (Adv-SLC) packaging technology, which utilizes new composite materials. Adv-SLC is a build-up substrate technology designed to fulfill the requirements of the most advanced semiconductor chips. Our new dielectric material is a build-up layer composed of two different materials. We also used a new material for the core substrate, composed of liquid crystalline polymer reinforced with glass cloth. The build-up layer has the following, highly reliable properties: it can maintain both conductivity and dielectricity under the conditions of both a line/space width of 10/10 μm and a via diameter of 30 μm . The core substrate also has excellent, reliable properties: it can maintain both conductivity and dielectricity under the conditions of a through hole diameter of 60 μm and a through hole pitch of 120 μm. We were able to confirm that the formation of the new substrate with the aforementioned new design rules contributes to reduce the size of the silicon chip. Consequently, Adv-SLC contributes to reduce thermal stress when mounting a flip chip.
Starting Page	1908
Ending Page	1915
Page Count	8
File Size	1763463
File Format	PDF
ISSN	21563950
Volume Number	1
Issue Number	12
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2011-12-01
Publisher Place	U.S.A.
Access Restriction	One Nation One Subscription (ONOS)
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Substrates Wiring Resins Copper Glass Reliability substrate Liquid crystalline polymer packaging polyimide reliability
Content Type	Text
Resource Type	Article
Subject	Industrial and Manufacturing Engineering Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering

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