NDLI: Multichip Embedding Technology Using Fine-Pitch Cu

Content Provider	IEEE Xplore Digital Library
Author	Khan, S.A. Choudhury, A. Kumbhat, N. Pulugurtha, M.R. Sundaram, V. Meyer-Berg, G. Tummala, R.
Copyright Year	2011
Abstract	Increasing performance and functional density while maintaining low cost is a catalyst for technological progress in the field of packaging. From flip-chip with solder to a hybrid approach of copper and solder, many methods have been created to reach this objective. The 3-D Packaging Research Center at Georgia Tech has been revolutionizing interconnection technology with the multichip embedding chip-last approach, which utilizes ultrathin adhesive-bonded copper bumps to enable ultrafine-pitch chip-to-package interconnections. This technology has been proven to be highly reliable using a low-cost low-temperature direct copper-to-copper bonding approach at 30-μm pitch and ~20-μm standoff height copper-to-copper interconnections. This interconnection method provides a platform for integration with flip-chip packages through its proven ability to work well with different die sizes and thicknesses bonded to the surface of ultrathin organic substrates. The next step in advancing the chip-last approach is to investigate chip embedding at the single-chip and multichip levels. Consequently, this paper focuses on: 1) the design and fabrication of the test vehicle to examine the reliability of the previously demonstrated copper-to-copper interconnections after embedding a thin die in an organic substrate, and 2) assembly process development and reliability data for the interconnections. Specifically, advances in the assembly process include: 1) a novel method to perform chip-last assembly at the panel level leading to a 10-15 times reduction in assembly time per die, and 2) an improved two-step assembly process to achieve simultaneous die embedding and cavity planarization. This embedding technology and its advancements not only allow actives to be embedded in organic substrates but also enables higher functional integration at high-throughput, making chip-last adhesive bonding with low-profile copper-to-copper interconnections a robust chip embedding solution for the next generation of highly integrated heterogeneous subsystems.
Starting Page	197
Ending Page	204
Page Count	8
File Size	1317462
File Format	PDF
ISSN	21563950
Volume Number	3
Issue Number	2
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2013-01-01
Publisher Place	U.S.A.
Access Restriction	One Nation One Subscription (ONOS)
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Assembly Substrates Cavity resonators Reliability Surface treatment Bonding Vehicles packaging Copper interconnections
Content Type	Text
Resource Type	Article
Subject	Industrial and Manufacturing Engineering Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering

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1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
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9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in

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