NDLI: Multidisciplinary Approach for Robust Package Design of MEMS Accelerometers

Content Provider	IEEE Xplore Digital Library
Author	Jian Wen Sarihan, V. Myers, B. Li, G.
Copyright Year	2011
Abstract	Micro-electro-mechanical systems (MEMS) packaging is becoming increasingly critical and plays a major role in the successful commercialization of MEMS products. The packaging system should enable the MEMS to perform the sensing function and at the same time protect it from environmental exposure. The design of the package should be robust enough to be able to withstand minor handling and manufacturing induced defects. Failures due to these defects are not unusual, one of our accelerometers in a small outline integrated circuit package has experienced a low ppm occurrence of device fracture. A multidisciplinary approach inclusive of vibration analysis, electrical response determination, stress analysis, and fracture mechanics are utilized to determine the appropriate package design. It is demonstrated here on a MEMS package for automotive airbag deployment. Along with the usual temperature exposure, this package also has to withstand a harsh vibration environment. The package is designed to avoid exciting MEMS resonance frequency to protect the transducer from sticking or clipping. At the same time, it delivers a reliable and intact transducer with no device fracture failures or output signal offset.
Starting Page	1934
Ending Page	1938
Page Count	5
File Size	745596
File Format	PDF
ISSN	21563950
Volume Number	1
Issue Number	12
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2011-12-01
Publisher Place	U.S.A.
Access Restriction	One Nation One Subscription (ONOS)
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Microassembly Micromechanical devices Stress Resonant frequency Sensors Transducers Materials reliability Fracture mechanics MEMS package design
Content Type	Text
Resource Type	Article
Subject	Industrial and Manufacturing Engineering Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering

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1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
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