NDLI: Correlating Interconnect Stress Test and Accelerated Thermal Cycling for Accessing the Reliabilities of High Performance Printed Circuit Boards

Content Provider	IEEE Xplore Digital Library
Author	Yung, W.K.C. Hai Ming Liem Choy, H.H.S. Yuen Wah Man
Copyright Year	2011
Abstract	Understanding the failure mechanism of a plated through hole (PTH) is essential for a complete picture of their life span, and hence for the continued electronic reliability prediction and development of high performance printed circuit boards. This paper presents the efficacy of establishing a correlation between interconnect stress test (IST) and accelerated thermal cycling (ATC) data on standard high performance coupons. In accord with the observation in PTH micro-sectioning, a PTH failure mechanism is proposed based on the thermal expansion-induced shearing at the copper-resin interface. The PTH cycle to failure data from the two methodologies, IST and ATC, are correlated. In terms of the glass transition temperature, a linear relationship exists between two different data sets. It is also demonstrated that the base material thermal property and PTH sizes are the two essential factors determining the reliability of a PTH. Furthermore, a life stress model is created to predict the life time of a coupon at a particular temperature level.
Starting Page	2005
Ending Page	2017
Page Count	13
File Size	1064400
File Format	PDF
ISSN	21563950
Volume Number	1
Issue Number	12
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2011-12-01
Publisher Place	U.S.A.
Access Restriction	One Nation One Subscription (ONOS)
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Stress Thermal stresses Reliability Copper Temperature measurement Resistance Materials printed circuit board Accelerated thermal cycling cycle to failure interconnect stress test plated through hole
Content Type	Text
Resource Type	Article
Subject	Industrial and Manufacturing Engineering Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering

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