NDLI: Proposal of Very High Performance and High Density Printed Wiring Board and Its Very High Productivity Manufacturing Processes

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Proposal of Very High Performance and High Density Printed Wiring Board and Its Very High Productivity Manufacturing Processes

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Proposal of Very High Performance and High Density Printed Wiring Board and Its Very High Productivity Manufacturing Processes

Content Provider	IEEE Xplore Digital Library
Author	Ohmi, T. Goto, T. Imai, H. Sugimura, M. Kawashima, O.
Copyright Year	2011
Abstract	Copper sputter-deposition by a newly developed technique called rotation magnetron sputtering is introduced for copper seed layer formation on printed wiring boards (PWBs) as an alternative to the electroless copper plating, which requires many complicated process steps as well as an intentional roughness-induced process to obtain practical adhesion capability between the copper and the resin. A rough copper surface degrades high-speed signal propagation due to an increase in conductive loss, and makes difficult the realization of further miniaturization of copper wirings. Thus, a very smooth surface layer of cycloolefin resin with a low dielectric constant and a low dielectric loss is introduced for realizing high-speed signal propagation, low electrical power consumption, and very high density packaging by introducing PWBs with a new structure, which are characterized by: 1) high characteristic impedance of 100 Ω instead of the current characteristic impedance of 50 Ω, which decreases the electrical power consumption down by one-half and increases the packaging density up to about four times by decreasing the copper wiring width down to one-fourth of the current characteristic impedance of 50 Ω, and 2) multi-resin step copper wiring to simultaneously establish very high density packaging by introducing 10-μm width copper wiring with 40 μm resin thickness and very high speed signal propagation with 80- and/or 120-μm resin thickness copper wiring. By introducing the plasma process steps, such as radio frequency bias Ar/H₂ plasma cleaning of the resin surface as well as the exposed inner copper surface, plasma nitridation of the resin surface, deposition of copper nitride, and deposition of the copper seed layer, a copper seed layer with a very smooth surface having very strong adhesion with the resin can be obtained. This technology greatly contributes to next-generation PWBs with very high performance and very high productivity.
Starting Page	486
Ending Page	494
Page Count	9
File Size	1166990
File Format	PDF
ISSN	21563950
Volume Number	1
Issue Number	4
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2011-04-01
Publisher Place	U.S.A.
Access Restriction	One Nation One Subscription (ONOS)
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Copper Plasmas Surface treatment Argon Substrates Cleaning Wiring very smooth surface copper wiring Electroless plating high characteristic impedance of 100 $\Omega$ new structure printed wiring board rotation magnet sputtering
Content Type	Text
Resource Type	Article
Subject	Industrial and Manufacturing Engineering Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in

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Proposal of Very High Performance and High Density Printed Wiring Board and Its Very High Productivity Manufacturing Processes

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