NDLI: Polyimide-Enhanced Stretchable Interconnects: Design, Fabrication, and Characterization

Content Provider	IEEE Xplore Digital Library
Author	Yung-Yu Hsu Gonzalez, M. Bossuyt, F. Vanfleteren, J. De Wolf, I.
Copyright Year	1963
Abstract	This paper discusses the optimization of a stretchable electrical interconnection between integrated circuits in terms of stretchability and fatigue lifetime. The interconnection is based on Cu stripes embedded in a polyimide-enhanced (PI-enhanced) layer. Design-of-experiment (DOE) methods and finite-element modeling were used to obtain an optimal design and to define design guidelines, concerning both stripe and layer dimensions and material selection. Stretchable interconnects with a PI-enhanced layer were fabricated based on the optimized design parameters and tested. In situ experimental observations did validate the optimal design. Statistical analysis indicated that the PI width plays the most important role among the different design parameters. By increasing the PI width, the plastic strain in the Cu stripes is reduced, and thus, the stretchability and fatigue lifetime of the system is increased. The experimental results demonstrate that the PI-enhanced stretchable interconnect enables elongations up to 250% without Cu rupture. This maximum elongation is two times larger than the one in samples without PI enhancement . Moreover, the fatigue life at 30% elongation is 470 times higher.
Sponsorship	IEEE Electron Devices Society
Starting Page	2680
Ending Page	2688
Page Count	9
File Size	1833489
File Format	PDF
ISSN	00189383
Volume Number	58
Issue Number	8
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2011-08-01
Publisher Place	U.S.A.
Access Restriction	One Nation One Subscription (ONOS)
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Copper Strain Conductors Plastics Response surface methodology stress Design for experiments design optimization failure analysis finite element methods flexible electronics integrated circuit interconnections integrated circuit packaging materials reliability strain
Content Type	Text
Resource Type	Article
Subject	Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering

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