NDLI: Fully Integrated Graphene and Carbon Nanotube Interconnects for Gigahertz High-Speed CMOS Electronics

Content Provider	IEEE Xplore Digital Library
Author	Xiangyu Chen Akinwande, D. Kyeong-Jae Lee Close, G.F. Yasuda, S. Paul, B.C. Fujita, S. Jing Kong Wong, H.P.
Copyright Year	1963
Abstract	Carbon-based nanomaterials such as metallic single-walled carbon nanotubes, multiwalled carbon nanotubes (MWCNTs), and graphene have been considered as some of the most promising candidates for future interconnect technology because of their high current-carrying capacity and conductivity in the nanoscale, and immunity to electromigration, which has been a great challenge for scaling down the traditional copper interconnects. Therefore, studies on the performance and optimization of carbon-based interconnects working in a realistic operational environment are needed in order to advance the technology beyond the exploratory discovery phase. In this paper, we present the first demonstration of graphene interconnects monolithically integrated with industry-standard complementary metal-oxide-semiconductor technology, as well as the first experimental results that compare the performance of high-speed on-chip graphene and MWCNT interconnects. The graphene interconnects operate up to 1.3-GHz frequency, which is a speed that is commensurate with the fastest high-speed processor chips today. A low-swing signaling technique has been applied to improve the speed of carbon interconnects up to 30%.
Sponsorship	IEEE Electron Devices Society
Starting Page	3137
Ending Page	3143
Page Count	7
File Size	791036
File Format	PDF
ISSN	00189383
Volume Number	57
Issue Number	11
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2010-01-01
Publisher Place	U.S.A.
Access Restriction	One Nation One Subscription (ONOS)
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Integrated circuit interconnections CMOS integrated circuits Wire Carbon nanotubes Nanomaterials on-chip graphene high speed interconnect
Content Type	Text
Resource Type	Article
Subject	Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering

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4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
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