NDLI: Signal integrity characterization of microwave XFP ASIC BGA package realized on low-K liquid crystal polymer (LCP) substrate

Content Provider	IEEE Xplore Digital Library
Author	Yazdani, F.
Copyright Year	1999
Description	With the development of low-K nanometer devices, the need for compatible packaging material is ever increasing. Liquid crystal polymer (LCP) is emerging as a promising material for RF, microwave, and millimeter-wave packaging. Its coefficient of thermal expansion can be matched to that of low-K die to ensure mechanical reliability. This paper, for the first time, characterizes the electrical performance of a wire bonded application-specific integrated circuit (ASIC) ball grid array (BGA) package based on LCP substrate technology for application in 10 Gb/s small form factor pluggable module (XFP) optical communication systems. Specifically, it compares the electrical performance of LCP to that of traditionally used FR4/spl I.bar/epoxy (FR-4) and Polyimide (PI) substrate materials. Findings show that at 10 GHz, insertion loss was decreased as much as 31% and 15% compared to FR-4 and PI, respectively. In particular, mode conversion was decreased by 66% and 42% compared to FR-4 and PI, respectively. Time delay was decreased by 10 and 4 ps compared to FR-4 and PI. No significant differences in power, ground coupling, and simultaneously switching output (SSO) noise at 10 GHz were observed. Based on the package structure used in this study, it was concluded that LCP offers superior electrical performance compared to FR/spl I.bar/4, PI, and is qualified as next generation substrate material for high data rate XFP BGA packaging.
Sponsorship	IEEE Components, Packaging, and Manufacturing Technology Society IEEE Components, Packaging and Manufacturing Technology Society
Starting Page	359
Ending Page	363
Page Count	5
File Size	287415
File Format	PDF
ISSN	15213323
Volume Number	29
Issue Number	2
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2006-05-01
Publisher Place	U.S.A.
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Application specific integrated circuits Liquid crystal polymers Microwave devices Crystalline materials Integrated circuit packaging Nanoscale devices Radio frequency Millimeter wave integrated circuits Millimeter wave communication Millimeter wave technology small form factor pluggable module (XFP) Application-specific integrated circuit (ASIC) ball grid array (BGA) FR-4 liquid crystal polymer (LCP) low-K microwave package polyimide radio frequency (RF) signal integrity
Content Type	Text
Resource Type	Article
Subject	Electrical and Electronic Engineering

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