NDLI: The development of Cu bonding wire with oxidation-resistant metal coating

Content Provider	IEEE Xplore Digital Library
Author	Kaimori, S. Nonaka, T. Mizoguchi, A.
Copyright Year	1999
Abstract	Although Cu bonding wire excels over Au bonding wire in some respects such as production costs, it has not been widely used because of its poor bondability at second bonds due to surface oxidation. We conceived an idea of electroplating oxidation-resistant metal on the Cu bonding wire to prevent the surface oxidation. The electroplating of Au, Ag, Pd, and Ni over Cu bonding wire all increased bond strengths as expected, but it caused problematic ball shapes except Pd-plated Cu bonding wire. The wire could produce the same ball shape as that of Au bonding wire. It was also proved to have excellent bondability sufficient to replace Au bonding wire. That is, it excelled in bond strengths, defective bonding ratio, and wideness of "Parameter Windows". It also showed the same stability as Au bonding wire in reliability tests, while bonds of Cu bonding wire were deteriorated in a few of the tests. In short, the Pd-plated Cu bonding wire can realize excellent bonding similar to Au bonding wire, while having much lower production costs.
Sponsorship	IEEE Components, Packaging, and Manufacturing Technology Society IEEE Components, Packaging and Manufacturing Technology Society
Starting Page	227
Ending Page	231
Page Count	5
File Size	856357
File Format	PDF
ISSN	15213323
Volume Number	29
Issue Number	2
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2006-05-01
Publisher Place	U.S.A.
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Bonding Wire Coatings Gold Production Costs Oxidation Shape Testing Stability wettability Copper bondability bonding wire electroplating melting point oxidation-resistance palladium reliability test
Content Type	Text
Resource Type	Article
Subject	Electrical and Electronic Engineering

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