NDLI: Handheld use condition-based bend test development

Content Provider	IEEE Xplore Digital Library
Author	Mercado, L.L. Phillips, B. Sahasrabudhe, S. Sedillo, J.P. Bray, D. Monroe, E. Kang Joon Lee Lo, G.
Copyright Year	1999
Abstract	For handheld electronic applications such as cell phones and personal digital assistants (PDAs), repeated key strokes could result in considerable flexure of the printed circuit board (PCB) mounted inside the housing. In this study, a standardized four-point bend test, including test board design, test setup, and test input level, has been developed. The S-N curve has been obtained by plotting the reliability at all deflection levels as a function of solder joint strain energy density. The effect of test frequency has also been evaluated. The reliability model prediction of three-point bend reliability matches the experimental data extremely well. The transfer function between reliability stressing and field condition is a strain-energy-density-based power law relationship. Finite-element simulation has been conducted for the worst case cell phone subjected to key presses. The use condition data including strain profiles and frequency have been incorporated in the field life prediction. The four-point bend performance can be converted into the component reliability during cell phone field use conditions. This study establishes the correlation between the use conditions and reliability tests. The cyclic four-point bend test will be implemented in the Joint Electron Device Engineering Council (JEDEC) bend test standard for handheld components.
Sponsorship	IEEE Components, Packaging, and Manufacturing Technology Society IEEE Components, Packaging and Manufacturing Technology Society
Starting Page	240
Ending Page	249
Page Count	10
File Size	2062486
File Format	PDF
ISSN	15213323
Volume Number	29
Issue Number	2
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2006-05-01
Publisher Place	U.S.A.
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Circuit testing Cellular phones Personal digital assistants Capacitive sensors Frequency Flexible printed circuits Soldering Predictive models Transfer functions Finite element methods three-point bend Cell phone cyclic bending field conditions finite-element modeling four-point bend handheld key presses life prediction personal digital assistant (PDA) reliability testing solder joint fatigue
Content Type	Text
Resource Type	Article
Subject	Electrical and Electronic Engineering

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