NDLI: Feasibility of PCB-Integrated Vibration Sensors for Condition Monitoring of Electronic Systems

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Feasibility of PCB-Integrated Vibration Sensors for Condition Monitoring of Electronic Systems

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Feasibility of PCB-Integrated Vibration Sensors for Condition Monitoring of Electronic Systems

Content Provider	The American Society of Mechanical Engineers (ASME) Digital Collection
Author	Brinkfeldt, Klas Wetter, Göran Lövberg, Andreas Tegehall, Per-Erik Andersson, Dag Strandberg, Jan Goncalves, Johnny Söderlund, Jonas Kwarnmark, Mikael
Copyright Year	2018
Abstract	The increasing complexity of electronics in systems used in safety critical applications, such as for example self-driving vehicles requires new methods to assure the hardware reliability of the electronic assemblies. Prognostics and Health Management (PHM) that uses a combination of data-driven and Physics-of-Failure models is a promising approach to avoid unexpected failures in the field. However, to enable PHM based partly on Physics-of-Failure models, sensor data that measures the relevant environment loads to which the electronics is subjected during its mission life are required. In this work, the feasibility to manufacture and use integrated sensors in the inner layers of a printed circuit board (PCB) as mission load indicators measuring impacts and vibrations has been investigated. A four-layered PCB was designed in which piezoelectric sensors based on polyvinylidenefluoride-co-trifluoroethylene (PVDF-TrFE) were printed on one of the laminate layers before the lamination process. Manufacturing of the PCB was followed by the assembly of components consisting of BGAs and QFN packages in a standard production reflow soldering process. Tests to ensure that the functionality of the sensor material was unaffected by the soldering process were performed. Results showed a yield of approximately 30% of the sensors after the reflow soldering process. The yield was also dependent on sensor placement and possibly shape. Optimization of the sensor design and placement is expected to bring the yield to 50 % or better. The sensors responded as expected to impact tests. Delamination areas were present in the test PCBs, which requires further investigation. The delamination does not seem to be due to the presence of embedded sensors alone but rather the result of a combination of several factors. The conclusion of this work is that it is feasible to embed piezoelectric sensors in the layers of a PCB.
Sponsorship	Electronic and Photonic Packaging Division
File Format	PDF
ISBN	9780791851920
DOI	10.1115/IPACK2018-8386
Conference Proceedings	ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems
Language	English
Publisher Date	2018-08-27
Publisher Place	San Francisco, California, USA
Access Restriction	Subscribed
Subject Keyword	Vibration Electronics Laminates Physics Stress Optimization Vehicles Condition monitoring Design Sensor placement Electronic systems Printed circuit boards Lamination Impact testing Hardware Sensors Manufacturing Safety Shapes Reliability Delamination Soldering Failure Reflow soldering
Content Type	Text
Resource Type	Article

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