NDLI: Multifunctional Chip for Use in Thermal Analysis of Power Systems

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Multifunctional Chip for Use in Thermal Analysis of Power Systems

Content Provider	The American Society of Mechanical Engineers (ASME) Digital Collection
Author	Gonzalez-Nino, David Boteler, Lauren Damian, P. Urciuoli Iain, M. Kierzewski Ibitayo, Dimeji Pedro, O. Quintero
Copyright Year	2018
Abstract	Many military electronic systems experience thermal transient pulses, in the sub-second range, during operation. Transient thermal solutions are being developed to address these transient pulses. In order to determine the performance of these thermal solutions, precise measurement of device junction temperature during the pulse is critical. Researchers have been patterning heaters onto chips using high temperature coefficient of resistance materials, thus allowing the use of the heater as a resistance temperature detector (RTD). For a given RTD material, in order to increase the sensitivity, a high resistance value is required; however, this equates to high voltages needed to get high heat fluxes. This work aims to design a test chip which balances between the instrumentation preferring a large resistance and the desire to maintain reasonable input voltages prompting a low resistance. This work demonstrates a novel multi-functional thermal test chip, which consists of 25 high resistance RTDs connected in parallel. This parallel connection strikes the desired balance by allowing a small overall chip resistance while allowing probing on a much higher resistance single RTD. Furthermore, this design allows optional temperature sensing at multiple locations on the chip’s surface, the possibility to create thermal gradients by controlled powering of individual resistors at different locations on the chip’s surface, and uniform heat flux over the entire chip surface.
Sponsorship	Electronic and Photonic Packaging Division
File Format	PDF
ISBN	9780791851920
DOI	10.1115/IPACK2018-8355
Conference Proceedings	ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems
Language	English
Publisher Date	2018-08-27
Publisher Place	San Francisco, California, USA
Access Restriction	Subscribed
Subject Keyword	Resistors Temperature Military systems Instrumentation High temperature Heat flux Resistance thermometers Temperature gradient Transients (dynamics) Design Heat Electronic systems Power systems (machinery) Flux (metallurgy) Thermal analysis Junctions
Content Type	Text
Resource Type	Article

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