NDLI: Failure Mechanism Assessment of TO-247 Packaged SiC Power Devices

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Failure Mechanism Assessment of TO-247 Packaged SiC Power Devices

Content Provider	The American Society of Mechanical Engineers (ASME) Digital Collection
Author	Brinkfeldt, Klas Wetter, Göran Lövberg, Andreas Andersson, Dag Toth-Pal, Zsolt Forslund, Mattias Shisha, Samer
Copyright Year	2018
Abstract	As the automotive industry shifts towards the electrification of drive trains, the efficiency of power electronics becomes more important. The use of silicon carbide (SiC) devices in power electronics has shown several benefits in efficiency, blocking voltage and high temperature operation. In addition, the ability of SiC to operate at higher frequencies due to lower switching losses can result in reduced weight and volume of the system, which also are important factors in vehicles. However, the reliability of packaged SiC devices is not yet fully assessed. Previous work has predicted that the different material properties of SiC compared to Si could have a large influence on the failure mechanisms and reliability. For example, the much higher elastic modulus of SiC compared to Si could increase strain on neighboring materials during power cycling. In this work, the failure mechanisms of packaged Si- and SiC-based power devices have been investigated following power cycling tests. The packaged devices were actively cycled in 4.5 s heating and 20 s cooling at ΔT = 60–80 K. A failure analysis using micro-focus X-ray and scanning acoustic microscopy (SAM) was carried out in order to determine the most important failure mechanisms. The results of the analysis indicate that the dominant failure mechanism is wire bond lift-off at the device chip for all of the SiC-based devices. Further analysis is required to determine the exact failure mechanisms of the analyzed Si-based devices. In addition, the SiC-based devices failed before the Si-based devices, which could be a result of the different properties of the SiC material.
Sponsorship	Electronic and Photonic Packaging Division
File Format	PDF
ISBN	9780791851920
DOI	10.1115/IPACK2018-8385
Conference Proceedings	ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems
Language	English
Publisher Date	2018-08-27
Publisher Place	San Francisco, California, USA
Access Restriction	Subscribed
Subject Keyword	Trains Elastic moduli Cooling X-rays Electronics Acoustics High temperature Wire Vehicles Microscopy Heating Automotive industry Failure analysis Weight (mass) Materials properties Silicon Reliability Failure mechanisms
Content Type	Text
Resource Type	Article

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