NDLI: On Thermal Interface Materials With Polydisperse Fillers: Packing Algorithm and Effective Properties

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On Thermal Interface Materials With Polydisperse Fillers: Packing Algorithm and Effective Properties

Content Provider	The American Society of Mechanical Engineers (ASME) Digital Collection
Author	Chowdhury, Piyas Sikka, Kamal Silva, Anuja De Seshadri, Indira
Copyright Year	2018
Abstract	Thermal interface materials (TIMs), which transmit heat from semiconductor chips, are indispensable in today’s microelectronic devices. Designing superior TIMs for increasingly demanding integration requirements, especially for server-level hardware with high power density chips, remains a particularly coveted yet challenging objective. This is because achieving desired degrees of thermal-mechanical attributes (e.g. high thermal conductivity, low elastic modulus, low viscosity) poses contradictory challenges. For instance, embedding thermally conductive fillers (e.g. metallic particles) into a compliant yet considerably less conductive matrix (e.g. polymer) enhances heat transmission, however at the expense of overall compliance. This leads to extensive trial-and-error based empirical approaches for optimal material design. Specifically, high volume fraction filler loading, role of filler size distribution, mixing of various filler types are some outstanding issues that need further clarification. To that end, we first forward a generic packing algorithm with ability to simulate a variety of filler types and distributions. Secondly, by modeling the physics of heat/force flux, we predict effective thermal conductivity, elastic modulus and viscosity for various packing cases.
Sponsorship	Electronic and Photonic Packaging Division
File Format	PDF
ISBN	9780791851920
DOI	10.1115/IPACK2018-8337
Conference Proceedings	ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems
Language	English
Publisher Date	2018-08-27
Publisher Place	San Francisco, California, USA
Access Restriction	Subscribed
Subject Keyword	Viscosity Power density Semiconductors (materials) Elastic moduli Packing (shipments) Packings (cushioning) Fillers (materials) Microelectronic devices Modeling Physics Design Errors Heat Algorithms Particulate matter Thermal conductivity Hardware Polymers Heat transfer
Content Type	Text
Resource Type	Article

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