NDLI: Local Measurements of Flow Boiling Heat Transfer on Hot Spots in 3D Compatible Radial Microchannels

Content Provider	The American Society of Mechanical Engineers (ASME) Digital Collection
Author	Yang, Fanghao Schultz, Mark Parida, Pritish Colgan, Evan Polastre, Robert Dang, Bing Tsang, Cornelia Gaynes, Michael Knickerbocker, John Chainer, Timothy
Copyright Year	2015
Abstract	Hot spots and temperature non-uniformities are critical thermal characteristics of current high power electronics and future three dimensional (3D) integrated circuits (ICs). Experimental investigation to understand flow boiling heat transfer on hot spots is required for any two-phase cooling configuration targeting these applications. This work investigates hot spot cooling utilizing novel radial microchannels with embedded pin arrays representing through-silicon-via (TSV) interconnects. Inlet orifices were designed to distribute flow in radial channels in a manner that supplies appropriate amounts of coolant to high-power-density cores. Specially designed test vehicles and systems were used to produce non-uniform heat flux profiles with nominally 20 W/cm2 background heating, 200 W/cm2 core heating and up to 21 W/mm2 hot spot (0.2 mm × 0.2 mm) heating to mimic a stackable eight core processor die (20 mm × 20 mm) with two hot spots on each core. The temperatures associated with flow boiling heat transfer at the hot spots were locally measured by resistance temperature detectors (RTDs) integrated between the heat source and sink. At nominal pressure and flow conditions, use of R1234ze in these devices resulted in a maximum hot spot temperature (Ths) of under 63 °C and average Ths of 57 °C at a hot spot power density of 21 W/mm2. A semi-empirical model was used to calculate the equivalent heat transfer rate around the hot spots which can provide a baseline for future studies on local thermal management of hot spots.
Sponsorship	Electronic and Photonic Packaging Division
File Format	PDF
ISBN	9780791856901
DOI	10.1115/IPACK2015-48341
Volume Number	Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays
Conference Proceedings	ASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems collocated with the ASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels
Language	English
Publisher Date	2015-07-06
Publisher Place	San Francisco, California, USA
Access Restriction	Subscribed
Subject Keyword	Power density Temperature Cooling Electronics Boiling Flow (dynamics) Density Pressure Heat flux Microchannels Resistance thermometers Vehicles Integrated circuits Heat Heating Orifices Coolants Thermal management Silicon Heat transfer
Content Type	Text
Resource Type	Article

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