NDLI: MEMS Die Warpage During Curing of Die Attach Material

Content Provider	The American Society of Mechanical Engineers (ASME) Digital Collection
Author	Lee, Hohyung Liu, Ruiyang Park, Seungbae Xue, Xiaojie
Copyright Year	2015
Abstract	Microelectromechanical system (MEMS) packages are vulnerable to stresses due to its functional structure. During the assembly process of the package, stresses stemming out of CTE mismatches of the structural elements and curing of the die attach material can cause warpage of the MEMS die [1]. Even though die attach material takes relatively small volumetric portion of the package, it plays a critical role in warpage of the die due to its location and sensitivity of a MEMS sensor. Most of virgin die attach adhesives are in a state of viscous liquid and, as it is cured the material properties such as modulus and CTE change. Accordingly, residual strain is cumulated on MEMS die after curing process and signal trim process is required. Therefore, the material properties changes depending on the curing profile is valuable information for assembly process of the MEMS package. To monitor the material properties changes and shrinkage during curing process, strain and modulus of a die attach material are measured in each curing step. Also, to investigate the material property change depending on the curing profile, two different curing profiles are used. Experimental data show that die attach materials are gradually cured after each thermal cycling, which cause the increment of the modulus and glass transition temperature (Tg) with shrinkage at elevated temperature. Using the measurement data, FEA model is built to predict the warpage of the MEMS die. In the FEA model, residual strain on MEMS die is calculated by inputting material properties of die attach in each curing step. Also, die warpage of the package during the curing process is monitored using an optical profiler for the validation of the simulation results.
Sponsorship	Electronic and Photonic Packaging Division
File Format	PDF
ISBN	9780791856901
DOI	10.1115/IPACK2015-48010
Volume Number	Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays
Conference Proceedings	ASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems collocated with the ASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels
Language	English
Publisher Date	2015-07-06
Publisher Place	San Francisco, California, USA
Access Restriction	Subscribed
Subject Keyword	Microelectromechanical systems Temperature Mems packages Warping Shrinkage (materials) Stress Glass transition Structural elements (construction) Adhesives Simulation results Materials properties Finite element analysis Manufacturing Sensors Signals Hardening (curing)
Content Type	Text
Resource Type	Article

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