NDLI: Use of Two-Phase CFD Simulations to Develop a Boiling Heat Transfer Prediction Method for Slug Flow Within Microchannels

Content Provider	The American Society of Mechanical Engineers (ASME) Digital Collection
Author	Magnini, Mirco John, R. Thome
Copyright Year	2015
Abstract	This work presents a new boiling heat transfer prediction method for slug flow within microchannels, which is developed and benchmarked against the results of two-phase CFD simulations. The proposed method adopts a two-zone decomposition of the flow for the sequential passage of a liquid slug and an evaporating elongated bubble. The heat transfer is modeled by assuming transient heat conduction across the liquid film surrounding an elongated bubble and sequential conduction/convection within the liquid slug. Embedded submodels for estimating important flow parameters, e.g. bubble velocity and liquid film thickness, are implemented as “building blocks”, thus making the entire modeling framework totally stand-alone. The CFD simulations are performed by utilizing ANSYS Fluent v. 14.5 and the interface between the vapor and liquid phases is captured by the built-in Volume Of Fluid algorithm. Improved schemes to compute the surface tension force and the phase change due to evaporation are implemented by means of self-developed functions. The comparison with the CFD results shows that the proposed method emulates well the bubble dynamics during evaporation, and predicts accurately the time-averaged heat transfer coefficients during the initial transient regime and the terminal steady-periodic stages of the flow.
Sponsorship	Electronic and Photonic Packaging Division
File Format	PDF
ISBN	9780791856901
DOI	10.1115/IPACK2015-48033
Volume Number	Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays
Conference Proceedings	ASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems collocated with the ASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels
Language	English
Publisher Date	2015-07-06
Publisher Place	San Francisco, California, USA
Access Restriction	Subscribed
Subject Keyword	Computational fluid dynamics Vapors Transient heat transfer Evaporation Boiling Flow (dynamics) Modeling Convection Microchannels Transients (dynamics) Blocks (building materials) Heat conduction Bubbles Fluids Algorithms Simulation Slug flows Dynamics (mechanics) Surface tension Engineering simulation Liquid films Heat transfer coefficients Heat transfer
Content Type	Text
Resource Type	Article

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