NDLI: Thermal and Optical Performance of Eco-Friendly Silk Fibroin Proteins as a Cavity Encapsulation Over LED Systems

Content Provider	The American Society of Mechanical Engineers (ASME) Digital Collection
Author	Yuruker, Sevket Umut Arik, Mehmet Tamdogan, Enes Melikov, Rustamjon Nizamoglu, Sedat Press, Daniel Aaron Durak, Ilkem
Copyright Year	2015
Abstract	The demand for high power LEDs for illumination applications is increasing. LED package encapsulation is one of most critical materials that affect the optical path of the generated light by LEDs, and may result in lumen degradation. A typical encapsulation material is a mixture of phosphor and a polymer based binder such as silicone. After LED chips are placed at the base of a cavity, phosphor particles are mixed with silicone and carefully placed into the cavity. One of the important technical challenges is to ensure a better thermal conductivity than 0.2 W/m-K of current materials for most of the traditional polymers in SSL applications. In this study, we investigated an unconventional material of the silk fibroin proteins for LED applications, and showed that this biomaterial provides thermal advantages leading to an order of magnitude higher thermal performance than conventional silicones. Silk fibroin is a natural protein and directly extracted from silk cocoons produced by Bombyx mori silkworm. Therefore, it presents a “green” material for photonic applications with its superior properties of biocompatibility and high optical transparency with a minimal absorption. Combining these properties with high thermal performance makes this biomaterial promising for future LED applications. An experimental and computational study to understand the optical and thermal performance is performed. A computational fluid dynamics study with a commercial CFD software was performed and an experimental set-up was developed to validate the computational findings to determine the thermal conductivity of the proposed material.
Sponsorship	Electronic and Photonic Packaging Division
File Format	PDF
ISBN	9780791856901
DOI	10.1115/IPACK2015-48326
Volume Number	Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays
Conference Proceedings	ASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems collocated with the ASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels
Language	English
Publisher Date	2015-07-06
Publisher Place	San Francisco, California, USA
Access Restriction	Subscribed
Subject Keyword	Transparency Computational fluid dynamics Binders (materials) Computer software Light-emitting diodes Biomaterials Proteins Cavities Absorption Phosphors Particulate matter Strategic materials Thermal conductivity Biocompatibility Polymers Silicones
Content Type	Text
Resource Type	Article

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