NDLI: Mechanical Properties of Lead Free Solder Alloy Measured by Nanoindentation

Content Provider	The American Society of Mechanical Engineers (ASME) Digital Collection
Author	Sun, Y. Xu, Z. H. Li, X. Shangguan, D. Liang, J.
Copyright Year	2007
Abstract	The elimination of lead from electronics due to its detrimental effects to environment is pushing component manufacturers to consider lead free solder alloy as an option. Application of lead free solder alloy requires a better understanding of its mechanical behavior at elevated temperatures and at small volume size. Such information is still lacking. In this study, nanoindentation technique was used to investigate the deformation behavior of the near eutectic ternary SAC387 (Sn 95.5 wt%, Ag 3.8 wt% and Cu 0.7 wt%) lead free solder alloy. The mechanical properties of each constituent phase in SAC387 were carefully measured and analyzed. Indentation tests were performed with different holding times to study the creep effects on the mechanical properties measured by nanoindentation. Microhardness tests were also carried out at temperatures above ambient temperature to investigate its influence on the mechanical properties.
Sponsorship	Electronic and Photonic Packaging Division
Starting Page	415
Ending Page	421
Page Count	7
File Format	PDF
ISBN	0791842789
DOI	10.1115/IPACK2007-33988
e-ISBN	0791838013
Volume Number	ASME 2007 InterPACK Conference, Volume 2
Conference Proceedings	ASME 2007 InterPACK Conference collocated with the ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference
Language	English
Publisher Date	2007-07-08
Publisher Place	Vancouver, British Columbia, Canada
Access Restriction	Subscribed
Subject Keyword	Lead-free solders Temperature Mechanical behavior Deformation Creep Alloys Nanoindentation Mechanical properties Electronics Tin Microhardness
Content Type	Text
Resource Type	Article

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