NDLI: Enhanced Thermoelectric Cooler for On-Chip Hot Spot Cooling

Content Provider	The American Society of Mechanical Engineers (ASME) Digital Collection
Author	Wang, Peng Bar-Cohen, Avram Yang, Bao
Copyright Year	2007
Abstract	Due to shrinking feature size and increasing transistor density, combined with the performance demanded from next-generation microprocessors, on-chip hot spots, with their associated high heat fluxes and sharp temperature gradients, have emerged as the primary driver for thermal management of today’s IC technology. This paper describes the novel use of thermoelectric coolers for on-chip hot spot cooling through the use of a copper mini-contact pad, which connects the thermoelectric cooler and the silicon chip thus concentrating the thermoelectric cooling power. A package-level numerical simulation is developed to predict the local on-chip hot spot cooling performance which can be achieved with such mini-contacts. Attention is focused on the hot spot temperature reduction associated with variations in mini-contact size and the thermoelectric element thickness, as well as the parasitic effect of the thermal contact resistance introduced by the mini-contact enhanced TEC. This numerical model and simulation results are validated by comparison to spot cooling experiments with a uniformly heated chip serving as the test vehicle. The experimental results demonstrate that a copper mini-contact pad can improve spot cooling performance by 80 ∼ 115% on a 500μm thick silicon chip under optimum operating conditions and that larger power dissipation on the chip leads to better spot cooling performance.
Sponsorship	Electronic and Photonic Packaging Division
Starting Page	249
Ending Page	258
Page Count	10
File Format	PDF
ISBN	0791842789
DOI	10.1115/IPACK2007-33798
e-ISBN	0791838013
Volume Number	ASME 2007 InterPACK Conference, Volume 2
Conference Proceedings	ASME 2007 InterPACK Conference collocated with the ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference
Language	English
Publisher Date	2007-07-08
Publisher Place	Vancouver, British Columbia, Canada
Access Restriction	Subscribed
Subject Keyword	Bi2te3 On-chip hot spot Thermal management Mini-contact Thermoelectric cooler Thermal contact resistance Contact resistance Cooling Thermoelectric coolers
Content Type	Text
Resource Type	Article

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