NDLI: Closed Loop Liquid Cooling for High Performance Computer Systems

Content Provider	The American Society of Mechanical Engineers (ASME) Digital Collection
Author	Kang, Sukhvinder Miller, David Cennamo, John
Copyright Year	2007
Abstract	The power dissipation levels in high performance personal computers continue to increase rapidly while the silicon die temperature requirements remain unchanged or have been lowered. Advanced air cooling solutions for the major heat sources such as CPU and GPU modules use heat pipes and high flow rate fans to manage the heat load at the expense of significant increases in the sound power emitted by the computer system. Closed loop liquid cooling systems offer an excellent means to efficiently meet the combined challenges of high heat loads, low thermal resistance, and low noise while easily managing die level heat fluxes in excess of 500 W/cm2. This paper describes the design and attributes of an advanced liquid cooling system that can cool single or multiple heat sources within the computer system. The cooling system described use copper cold plates with meso scale channels to pick up heat from CPU and GPU type heat sources and highly efficient liquid-to-air heat exchangers with flat copper tubes and plain fins to transfer the heat to air by forced convection. A water based coolant is used for high thermal performance and additives are used to provide burst protection to the cooling system at temperatures down to −40 °C and corrosion protection to critical components. A highly reliable compact pump is used to circulate the fluid in a closed loop. The overall system is integrated using assembly methods and materials that enable very low fluid permeation for long life.
Sponsorship	Electronic and Photonic Packaging Division
Starting Page	509
Ending Page	515
Page Count	7
File Format	PDF
ISBN	0791842789
DOI	10.1115/IPACK2007-33870
e-ISBN	0791838013
Volume Number	ASME 2007 InterPACK Conference, Volume 2
Conference Proceedings	ASME 2007 InterPACK Conference collocated with the ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference
Language	English
Publisher Date	2007-07-08
Publisher Place	Vancouver, British Columbia, Canada
Access Restriction	Subscribed
Subject Keyword	Computers Water Fans Temperature Graphics processing units Cooling systems Fins Corrosion protection Design Noise (sound) Fluids Thermal resistance Energy dissipation Coolants Silicon Manufacturing Copper Forced convection Cooling Heat exchangers Flow (dynamics) Stress Heat Pumps Heat pipes Plates (structures) Flux (metallurgy)
Content Type	Text
Resource Type	Article

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