NDLI: Zoom-In Modeling of Packages in Forced Convection Electronics Cooling Incorporating a Superposition Approach

Content Provider	The American Society of Mechanical Engineers (ASME) Digital Collection
Author	Neelakantan, Sriram Joiner, Bennett Richard, L. Scott
Copyright Year	2007
Abstract	The wide disparity of scales in a typical electronics system makes it difficult to simultaneously evaluate the flow and heat transfer characteristics at the system/board level as well as the component level in a CFD (Computational Fluid Dynamics) simulation. The determination of junction temperatures of individual components necessitates a zoom-in approach, where data obtained from the system level simulation is used as an input for the component level model. This requires the accurate specification of boundary conditions to describe the effects of the local package environment. For conditions involving complex flow situations and heat spreading in the board, this task can be challenging. The present work proposes a method where the flow boundary conditions are obtained from a macroscopic board level model. The junction temperatures are obtained using a superposition approach. The zoom-in model requires fewer grid cells, enabling quicker evaluation of junction temperatures. An additional advantage is that heat sinks can be optimized within the zoom in model and the junction temperatures directly predicted without having to run the complete board model at every stage in the design. The method is verified against experiment.
Sponsorship	Electronic and Photonic Packaging Division
Starting Page	429
Ending Page	435
Page Count	7
File Format	PDF
ISBN	0791842789
DOI	10.1115/IPACK2007-33280
e-ISBN	0791838013
Volume Number	ASME 2007 InterPACK Conference, Volume 2
Conference Proceedings	ASME 2007 InterPACK Conference collocated with the ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference
Language	English
Publisher Date	2007-07-08
Publisher Place	Vancouver, British Columbia, Canada
Access Restriction	Subscribed
Subject Keyword	Forced convection Temperature Computational fluid dynamics Electronics Computer cooling Flow (dynamics) Modeling Design Heat Simulation Boundary-value problems Heat sinks Junctions Heat transfer
Content Type	Text
Resource Type	Article

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