NDLI: Thermal Reliability and Environmental Testing of Advanced Metal Diamond Composites

Content Provider	The American Society of Mechanical Engineers (ASME) Digital Collection
Author	Bollina, Ravi Landgraf, Janet Wagner, Hannes Wilhelm, Robert Knippscheer, Sven Mitic, Gerhard Levchuck, Svetlana
Copyright Year	2007
Abstract	Advanced diamond composites with matrix metal silver, copper and aluminum alloys were developed for heat sinks and base plates in high performance electronic packages. The reliability of these composites under extreme thermal and environmental conditions was investigated in the thermal cycling and pressure cooker tests. Thermal cycling tests on metal diamond composites were performed in a two chamber cycling oven between −55°C and +150°C for 1000 thermal cycles with 20 minutes storage time in each chamber. The effect of humidity and pressure was assessed from pressure cooker test at 121°C at 2 bar for 168 h. Thermal properties such as thermal diffusivity and specific heat were measured before and after the thermal cycling to observe any changes in thermal properties of the composites due to any possible interfacial degradation. The thermal properties of the composites did not decrease and the interfaces did not degrade after the thermal cycling tests in case of Ag-diamond composites. Al-diamond composites show a slight decrease of 5–8% in thermal diffusivity after thermal cycling. The thermal diffusivity of the Cu/Cr based diamond composite is unaltered before and after testing. The thermal diffusivity of Cu/Si diamond composites decreased by 43% at room temperature measured value. Al-diamond composites did not show any degradation during the pressure cooker tests although aluminum carbide is hygroscopic and deteriorates under moisture. Ag and Al-diamond composites survived the pressure cooker test. Cu/Si and Cu/Cr based diamond composites showed a slight change in coloration and a possible corrosion after the pressure cooker test.
Sponsorship	Electronic and Photonic Packaging Division
Starting Page	389
Ending Page	397
Page Count	9
File Format	PDF
ISBN	0791842770
DOI	10.1115/IPACK2007-33028
e-ISBN	0791838013
Volume Number	ASME 2007 InterPACK Conference, Volume 1
Conference Proceedings	ASME 2007 InterPACK Conference collocated with the ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference
Language	English
Publisher Date	2007-07-08
Publisher Place	Vancouver, British Columbia, Canada
Access Restriction	Subscribed
Subject Keyword	Cycles Temperature Aluminum Metals Diamonds Thermal diffusivity Aluminum alloys Electronic packages Pressure Thermal properties Silver Specific heat Composite materials Ovens Storage Corrosion Plates (structures) Reliability Copper Heat sinks Testing
Content Type	Text
Resource Type	Article

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in

Advanced composite materials with tailored thermal properties for heat sink applications

The Development of a Bonded Fin Graphite/Epoxy Heat Sink for High Performance Servers

A Study of Developing Composite Material of Penetrated Diamond Particles Into Metal Plate

Characterization of swaged mixed metal heat sinks

Advanced Heat Transfer Devices for Aerospace Applications

Stress and Temperature Simulation Using Copper-Diamond Composite Slug

Thermal Properties of Polymer-Metal Composites

Performance of Thermal Enhancement Materials in High Pressure Metal Hydride Storage Systems

Thermal Management Using Composite Structures

Thermal Reliability and Environmental Testing of Advanced Metal Diamond Composites

Similar Documents

Advanced composite materials with tailored thermal properties for heat sink applications

The Development of a Bonded Fin Graphite/Epoxy Heat Sink for High Performance Servers

A Study of Developing Composite Material of Penetrated Diamond Particles Into Metal Plate

Characterization of swaged mixed metal heat sinks

Advanced Heat Transfer Devices for Aerospace Applications

Stress and Temperature Simulation Using Copper-Diamond Composite Slug

Thermal Properties of Polymer-Metal Composites

Performance of Thermal Enhancement Materials in High Pressure Metal Hydride Storage Systems

Thermal Management Using Composite Structures

Thermal Reliability and Environmental Testing of Advanced Metal Diamond Composites