NDLI: Development of an Automated Solder Inspection System With Neural Network Using Oblique Computed Tomography

Content Provider	The American Society of Mechanical Engineers (ASME) Digital Collection
Author	Teramoto, Atsushi Murakoshi, Takayuki Tsuzaka, Masatoshi Fujita, Hiroshi
Copyright Year	2007
Abstract	The high density LSI packages such as BGA is being utilized in the car electronics and communications infrastructure products. These products require a high-speed and reliable inspection technique for their solder joints. In this paper, an automated X-ray inspection system for BGA mounted substrate based on oblique computed tomography are proposed. Automated inspection consisted of OCT capturing, position adjustment, bump extraction, character extraction and judgment. Five characteristic features related to the bump shape are introduced. And by combining the characteristic features using artificial neural network, the condition of solder bump was judged. In the experiments, these techniques were evaluated using actual BGA mounted substrate. As a result, the correct rate of judgment reached 99.7%, which shows the clear evidence that proposed techniques may be useful in the practice.
Sponsorship	Electronic and Photonic Packaging Division
Starting Page	453
Ending Page	457
Page Count	5
File Format	PDF
ISBN	0791842770
DOI	10.1115/IPACK2007-33017
e-ISBN	0791838013
Volume Number	ASME 2007 InterPACK Conference, Volume 1
Conference Proceedings	ASME 2007 InterPACK Conference collocated with the ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference
Language	English
Publisher Date	2007-07-08
Publisher Place	Vancouver, British Columbia, Canada
Access Restriction	Subscribed
Subject Keyword	Solder joints Solders Ball-grid-array packaging Artificial neural networks X-rays Inspection Electronics Shapes Density Computerized tomography
Content Type	Text
Resource Type	Article

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