NDLI: Co-Firing Technology for Buried Resistors

Content Provider	The American Society of Mechanical Engineers (ASME) Digital Collection
Author	Yadagiri, G. Goswami, K. K. Gurumurthy, K. S. Satyam, Null Shankara, K. N.
Copyright Year	2003
Abstract	The complexity and performance of the electronic components and systems is increasing and placing greater demands on compact packaging and interconnection technologies. Multilayer thick film technology is one of the important technologies adopted in the miniaturization of electronic systems. Normally only interconnections are made in the intermediate layers. The possibility of fabricating resistors along with interconnections in the intermediate layers using conventional thick film materials using co-firing process has been examined in this paper. Normally multilayer structures are fabricated by printing / drying / firing of each layer separately starting from the bottom most layer (sequential processing). In this process the bottom layers undergo sintering many times. To avoid many firing cycles and to save power and processing time, a study is taken up to examine the effects of co-firing on the multilayer structure with embedded resistors. The results of the study are presented in this paper.
Sponsorship	Electronic and Photonic Packaging Division
Starting Page	203
Ending Page	208
Page Count	6
File Format	PDF
ISBN	0791836908
DOI	10.1115/IPACK2003-35336
e-ISBN	0791836746
Volume Number	2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1
Conference Proceedings	ASME 2003 International Electronic Packaging Technical Conference and Exhibition
Language	English
Publisher Date	2003-07-06
Publisher Place	Maui, Hawaii, USA
Access Restriction	Subscribed
Subject Keyword	Co-firing Miniaturization Buried resistors Thick films Resistors
Content Type	Text
Resource Type	Article

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