NDLI: Measurement of Stress and Delamination in Flip Chip on Laminate Assemblies

Content Provider	The American Society of Mechanical Engineers (ASME) Digital Collection
Author	Rahim, M. Kaysar Jeffrey, C. Suhling Copeland, D. Scott Richard, C. Jaeger Lall, Pradeep
Copyright Year	2003
Abstract	Mechanical stress distributions in packaged silicon die that have resulted during assembly or environmental testing can be accurately characterized using test chips incorporating integral piezoresistive sensors. In this paper, an overview of recent measurements made in flip chip on laminate assemblies with (111) silicon test chips is presented. Transient die stress measurements have been made during underfill cure, and the room temperature die stresses in final cured assemblies have been compared for several different underfill encapsulants. The experimental stress measurements in the flip chip samples were then correlated with finite element predictions for the tested configurations. In addition, stress variations have been monitored in the assembled flip chip die as the test boards were subjected to slow temperature changes from −40 to +150°C. Finally the stress variations occurring during thermal cycling from −40 to +125°C have been characterized. These measurements have been correlated with the delaminations occurring at the die passivation to underfill interface measured using C-mode Scanning Acoustic Microscopy (C-SAM). Using the measurements and numerical simulations, valuable insight has been gained on the effects of assembly variables and underfill material properties on the reliability of flip chip packages.
Sponsorship	Electronic and Photonic Packaging Division
Starting Page	907
Ending Page	921
Page Count	15
File Format	PDF
ISBN	0791836908
DOI	10.1115/IPACK2003-35319
e-ISBN	0791836746
Volume Number	2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1
Conference Proceedings	ASME 2003 International Electronic Packaging Technical Conference and Exhibition
Language	English
Publisher Date	2003-07-06
Publisher Place	Maui, Hawaii, USA
Access Restriction	Subscribed
Subject Keyword	Temperature Computer simulation Flip-chip Acoustics Laminates Stress Transients (dynamics) Flip-chip packages Microscopy Materials properties Silicon Manufacturing Finite element analysis Sensors Flip-chip devices Reliability Delamination Lumber Testing
Content Type	Text
Resource Type	Article

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