NDLI: Impact Reliability Study of BGA Solder Joints and Dropping Test Method

Content Provider	The American Society of Mechanical Engineers (ASME) Digital Collection
Author	Yu, Qiang Kikuchi, Hironobu Watanabe, Keiji Siratori, Masaki Kakino, Manabu Fujiwara, Noriyuki
Copyright Year	2003
Abstract	The purpose of this study is to develop an assessment method for drop impact reliability of BGA solder joints. In this paper, the dynamic deformation behavior of PCB is examined to evaluate the dynamic fracture of solder joints, where a free fall drop-impact test was used, and explicit-based FEM code LSDYNA was used to study the basic behavior of the drop-impact test, and the effects of falling angle on the dynamic behavior of PCB were discussed. As a result, it was confirmed even if collision angle is very small, the dynamic deformation of PCB was drastically affected by the collision angle. In this study, the authors proposed that the dynamic behavior can dramatically be improved by attaching a hemisphere on the jig bottom to obtain stable dynamic deformation of the PCB. Furthermore, in case of that the PCB flexural rigidity was changed, the optimal test jig was designed so that the PCB and the jig for a drop test might not cause resonance vibration. Generally, the crack growing assessment and drop impact strength evaluation for solder joints were studied by a fine meshing FEM model, nevertheless it causes a rapid augmentation of calculation cost. In this study, the authors proposed a new method of transient response analysis by utilizing implicit based FEM analysis code to drop the calculation cost of impact study. It was shown that the present method can accurately simulate the dynamic behavior of BGA packaging including the time histories of the deformations and stresses, and it can drop the CPU time to about one tenth of that of explicit based analysis code.
Sponsorship	Electronic and Photonic Packaging Division
Starting Page	777
Ending Page	782
Page Count	6
File Format	PDF
ISBN	0791836908
DOI	10.1115/IPACK2003-35139
e-ISBN	0791836746
Volume Number	2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1
Conference Proceedings	ASME 2003 International Electronic Packaging Technical Conference and Exhibition
Language	English
Publisher Date	2003-07-06
Publisher Place	Maui, Hawaii, USA
Access Restriction	Subscribed
Subject Keyword	Transient response analysis Drop impact test Bga solder joints Solder joints Reliability Ball-grid-array packaging Transients (dynamics)
Content Type	Text
Resource Type	Article

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in