NDLI: Thermal Conductivity Performance Modeling and Characterization of a Novel Anisotropic Conductive Adhesive Used in Lead-Free Electronics Packaging

Content Provider	The American Society of Mechanical Engineers (ASME) Digital Collection
Author	Matthew, J. Combs Ramkumar, S. Manian Kandlikar, Satish
Copyright Year	2012
Abstract	The continued desire to utilize an alternative to lead-based solder materials for electrical interconnections has led to significant research interest in Anisotropic Conductive Adhesives (ACAs). The use of ACAs in electrical connections creates bonds using a combination of metal particles and epoxies to replace solder. The novel ACA discussed in this paper allows for bonds to be created through aligning columns of conductive particles along the Z-axis. These columns are formed by the application of a magnetic field, during the curing process. The benefit of this novel ACA is that it does not require precise printing of the adhesive on pads and also enables the mass curing without creating shorts in the circuitry. This paper will present the findings of the thermal conductivity performance tests using the novel ACA and its applicability as a thermal interface material and for assembling bottom termination components, power devices, etc. The columns that act as electrical conduction paths also contribute towards the thermal conductivity. The thermal conductivity of the novel ACA was measured utilizing a system that is similar to that in ASTM (American Society of Testing Materials) D5470 standard. The goal was to examine the influence of Bond Line Thickness (BLT), particle loading densities, particle diameters and adhesive matrix curing conditions on the electrical and thermal performance of the novel ACA. This paper will also present a numerical model to describe the thermal behavior of the novel ACA. The novel ACA’s applicability for PCB-level assembly has also been successfully demonstrated by RIT, including base material characterization, effect of process parameters, failures, and long-term reliability. Reliability testing included the investigation of the assembly performance in temperature and humidity aging, thermal aging, air-to-air thermal cycling, and drop testing.
Starting Page	1161
Ending Page	1166
Page Count	6
File Format	PDF
ISBN	9780791845257
DOI	10.1115/IMECE2012-89672
Volume Number	Volume 9: Micro- and Nano-Systems Engineering and Packaging, Parts A and B
Conference Proceedings	ASME 2012 International Mechanical Engineering Congress and Exposition
Language	English
Publisher Date	2012-11-09
Publisher Place	Houston, Texas, USA
Access Restriction	Subscribed
Subject Keyword	Epoxy adhesives Printing Solders Temperature Computer simulation Metals Accelerated life testing Modeling Astm international Heat conduction Adhesives Anisotropy Electronic packaging Particulate matter Epoxy resins Testing equipment Testing performance Thermal conductivity Manufacturing Magnetic fields Reliability Hardening (curing) Failure Testing
Content Type	Text
Resource Type	Article

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