NDLI: Curing kinetics of anisotropic conductive adhesive film

Content Provider	Springer Nature Link
Author	Chan, Y. C. Uddin, M. A. Alam, M. O. Chan, H. P.
Copyright Year	2003
Abstract	Polymer-based conductive-adhesive materials have become widely used in many electronic packaging interconnect applications, such as chip-on-glass, chip-on-flex, etc. Among all the conductive-adhesive materials, anisotropic conductive adhesive film (ACF) is an attractive interconnect material because of its fine pitch capability. Anisotropic conductive-adhesive film is a thermosetting, epoxy matrix impregnated with a small amount of electrically conductive particles. During component assembly, the epoxy resin is cured to provide mechanical connection, and the conducting medium provides electrical connection in the z direction. The thermal cure process is critical to develop the ultimate electrical and mechanical properties of the ACF. In this paper, the curing reaction of ACF was studied with a differential scanning calorimeter (DSC) under isothermal conditions in the range of 120–180°C. An autocatalyzed kinetic model was used to describe the curing reaction. The rate constant and the reaction orders were determined and used to predict the progress of the curing reaction. A good agreement is found between the proposed kinetic model and the experimental reaction-rate data. The reaction-rate constants were correlated with the isothermal temperature by the Arrhenius equation. The glass-transition temperature also has been studied as a function of cure degree and moisture absorption.
Starting Page	131
Ending Page	136
Page Count	6
File Format	PDF
ISSN	03615235
Journal	Journal of Electronic Materials
Volume Number	32
Issue Number	3
e-ISSN	1543186X
Language	English
Publisher	Springer-Verlag
Publisher Date	2003-01-01
Publisher Place	New York
Access Restriction	One Nation One Subscription (ONOS)
Subject Keyword	Anisotropic conductive adhesive film curing autocatalytic-kinetic model glass-transition temperature Optical and Electronic Materials Characterization and Evaluation of Materials Electronics and Microelectronics, Instrumentation Solid State Physics and Spectroscopy
Content Type	Text
Resource Type	Article
Subject	Materials Chemistry Electronic, Optical and Magnetic Materials Condensed Matter Physics Electrical and Electronic Engineering

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