NDLI: Highly reliable flip-chip-on-flex package using multilayered anisotropic conductive film

Content Provider	Springer Nature Link
Author	Yim, Myung Jin Hwang, Jin Sang Kim, Jin Gu Ahn, Jin Yong Kim, Hyung Joon Kwon, Woonseong Paik, Kyung Wook
Copyright Year	2004
Abstract	Anisotropic conductive film (ACF) has been used as interconnect material for flat-panel display module packages, such as liquid crystal displays (LCDs) in the technologies of tape automated bonding (TAB), chip-on-glass (COG), chip-on-film (COF), and chip-on-board (COB). Among them, COF is a relatively new technology after TAB and COG bonding, and its requirement for ACF becomes more stringent because of the need of high adhesion and fine-pitch interconnection. To meet these demands, strong interfacial adhesion between the ACF, substrate, and chip is a major issue. We have developed a multilayered ACF that has functional layers on both sides of a conventional ACF layer to improve the wetting properties of the resin on two-layer flex for better interface adhesion and to control the flow of conductive particles during thermocompression bonding and the resulting reliability of the interconnection using ACF. To investigate the enhancement of electrical properties and reliability of multilayered ACF in COF assemblies, we evaluated the performance in contact resistance and adhesion strength of a multilayered ACF and single-layered ACF under various environmental tests, such as a thermal cycling test (−55°C/+160°C, 1,000 cycles), a high-temperature humidity test (85°C/85% RH, 1,000 h), and a high-temperature storage test (150°C, 1,000 h). The contact resistance of the multilayered ACF joint was in an acceptable range of around a 10% increase of the initial value during the 85°C/85% RH test compared with the single-layered ACF because of the stronger moisture resistance of the multilayered ACF and flex substrate. The multilayered ACF has better adhesion properties compared with the conventional single-layered ACF during the 85°C/85% RH test because of the enhancement of the wetting to the surface of the polymide (PI) flex substrate with an adhesion-promoting nonconductive film (NCF) layer of multilayered ACF. The new ACF of the multilayered structure was successfully demonstrated in a fine-pitch COF module with a two-layer flex substrate.
Starting Page	76
Ending Page	82
Page Count	7
File Format	PDF
ISSN	03615235
Journal	Journal of Electronic Materials
Volume Number	33
Issue Number	1
e-ISSN	1543186X
Language	English
Publisher	Springer-Verlag
Publisher Date	2004-01-01
Publisher Place	New York
Access Restriction	One Nation One Subscription (ONOS)
Subject Keyword	Flip chip chip-on-film (COF) anisotropic conductive film adhesion reliability Optical and Electronic Materials Characterization and Evaluation of Materials Electronics and Microelectronics, Instrumentation Solid State Physics and Spectroscopy
Content Type	Text
Resource Type	Article
Subject	Materials Chemistry Electronic, Optical and Magnetic Materials Condensed Matter Physics Electrical and Electronic Engineering

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